EEWORLDEEWORLDEEWORLD

Part Number

Search

V62C2802048LL-55B

Description
Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48
Categorystorage    storage   
File Size95KB,10 Pages
ManufacturerMosel Vitelic Corporation ( MVC )
Websitehttp://www.moselvitelic.com
Download Datasheet Parametric Compare View All

V62C2802048LL-55B Overview

Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48

V62C2802048LL-55B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMosel Vitelic Corporation ( MVC )
Parts packaging codeBGA
package instructionTFBGA, BGA36,6X8,30
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length12 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA36,6X8,30
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000001 A
Minimum standby current1 V
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.2 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width9 mm
Base Number Matches1
V62C2802048L(L)
Ultra Low Power
256K x 8 CMOS SRAM
Features
• Low-power consumption
- Active: 35mA at 55ns
- Stand-by: 10
µA
(CMOS input/output)
2
µA
CMOS input/output, L version
• Single +2.2 to 2.7V Power Supply_Typical
• Extented Voltage from 2.2 to 3.6V.
• Equal access and cycle time
• 55/70/85/100 ns access time
• Easy memory expansion with CE1, CE2
and OE inputs
• 1.0V data retention mode
• TTL compatible, Tri-state input/output
• Automatic power-down when deselected
• Package available: 32L TSOP(I)/ STSOP(I)
• 48 Ball CSP_BGA
Functional Description
The V62C2802048L is a low power CMOS Static RAM
organized as 262,144 words by 8 bits. Easy memory exp-
ansion is provided by an active LOW CE1, an active
HIGH CE2, an active LOW OE, and Tri-state I/O’s. This
device has an automatic power-down mode feature when
deselected.
Writing to the device is accomplished by taking Chip
Enable 1 (CE1) with Write Enable (WE) LOW, and Chip
Enable 2 (CE2) HIGH. Reading from the device is per-
formed by taking Chip Enable 1 (CE1) with Output
Enable (OE) LOW while Write Enable (WE) and Chip
Enable 2 (CE2) is HIGH. The I/O pins are placed in a
high-impedance state when the device is deselected: the
outputs are disabled during a write cycle.
TheV62C2802048LL comes with a 1V data retention fe-
ature and Lower Standby Power. The V62C2802048L is
avalable in a 32-pin 8 x 20 mm TSOP1 / STSOP 8x13.4 mm
and CSP type 48-fpBGA packages.
Logic Block Diagram
32-Pin TSOP1 / STSOP
(CSP_BGA See next page)
A
11
A
9
A
8
INPUT BUFFER
ROW DECODER
SENSE AMP
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A9
A
13
WE
CE
2
I/O8
Cell Array
A
15
Vcc
A17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
I/O1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A
10
CE1
I/O
8
I/O
7
I/O
6
I/O
5
I/O
4
GND
I/O
3
I/O
2
I/O
1
A
0
A
1
A
2
A
3
COLUMN DECODER
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
CONTROL
CIRCUIT
OE
WE
CE1
CE2
1
REV. 1.2
May
2001 V62C2802048L(L)

V62C2802048LL-55B Related Products

V62C2802048LL-55B V62C2802048LL-55BI V62C2802048LL-100VI V62C2802048LL-55TI
Description Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48 Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48 Standard SRAM, 256KX8, 100ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP-32 Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC )
Parts packaging code BGA BGA TSOP TSOP1
package instruction TFBGA, BGA36,6X8,30 TFBGA, BGA36,6X8,30 TSOP1, TSSOP32,.56,20 TSOP1, TSSOP32,.8,20
Contacts 48 48 32 32
Reach Compliance Code unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 55 ns 55 ns 100 ns 55 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PDSO-G32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0
length 12 mm 12 mm 12.4 mm 18.4 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 48 48 32 32
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C
organize 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TSOP1 TSOP1
Encapsulate equivalent code BGA36,6X8,30 BGA36,6X8,30 TSSOP32,.56,20 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.5 V 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum standby current 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Minimum standby current 1 V 1 V 1 V 1 V
Maximum slew rate 0.035 mA 0.035 mA 0.02 mA 0.035 mA
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.2 V 2.2 V 2.2 V 2.2 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL GULL WING GULL WING
Terminal pitch 0.75 mm 0.75 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 9 mm 9 mm 8 mm 8 mm
Explanation of the parameters and terms of the power module
[align=left][color=rgb(85, 85, 85)][font=微软雅黑][size=12px]In the power module technical manual provided by the manufacturer, there are generally a lot of parameter data. The main parameter terms are ex...
tgd343310381 Power technology
How to switch from NetworkManager to systemd on Linux
How to Switch from NetworkManager to systemd on Linux In the Linux world, the adoption of systemd has been a subject of intense debate, with the flames of war still raging between its supporters and o...
奋斗之路 Linux and Android
It would be best to exchange for a development board that can run LINUX and has a screen
[url]https://bbs.eeworld.com.cn/thread-476244-1-1.html[/url] I want to replace the DSP board I have on hand with a development board that can run LINUX for work....
908508455a Buy&Sell
【Design Tools】XILINX+FPGA+CPLD Design+ISE Quick Start [Beginner's Tutorial].pdf
【Design Tools】XILINX+FPGA+CPLD Design+ISE Quick Start [Beginner's Tutorial].pdf...
nwx8899 FPGA/CPLD
SMD Soldering Guidelines
SMD Soldering Guidelines...
yuzi987 Talking
Revealing how eLTE-loT builds the Industrial Internet of Things?
The industrial Internet of Things market is booming, and the number of industrial equipment connected is also growing rapidly, which is conducive to the construction of the industrial Internet of Thin...
火辣西米秀 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1533  2922  1503  750  753  31  59  16  30  5 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号