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V62C2802048LL-100VI

Description
Standard SRAM, 256KX8, 100ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP-32
Categorystorage    storage   
File Size95KB,10 Pages
ManufacturerMosel Vitelic Corporation ( MVC )
Websitehttp://www.moselvitelic.com
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V62C2802048LL-100VI Overview

Standard SRAM, 256KX8, 100ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP-32

V62C2802048LL-100VI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMosel Vitelic Corporation ( MVC )
Parts packaging codeTSOP
package instructionTSOP1, TSSOP32,.56,20
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length12.4 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP32,.56,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000001 A
Minimum standby current1 V
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.2 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
V62C2802048L(L)
Ultra Low Power
256K x 8 CMOS SRAM
Features
• Low-power consumption
- Active: 35mA at 55ns
- Stand-by: 10
µA
(CMOS input/output)
2
µA
CMOS input/output, L version
• Single +2.2 to 2.7V Power Supply_Typical
• Extented Voltage from 2.2 to 3.6V.
• Equal access and cycle time
• 55/70/85/100 ns access time
• Easy memory expansion with CE1, CE2
and OE inputs
• 1.0V data retention mode
• TTL compatible, Tri-state input/output
• Automatic power-down when deselected
• Package available: 32L TSOP(I)/ STSOP(I)
• 48 Ball CSP_BGA
Functional Description
The V62C2802048L is a low power CMOS Static RAM
organized as 262,144 words by 8 bits. Easy memory exp-
ansion is provided by an active LOW CE1, an active
HIGH CE2, an active LOW OE, and Tri-state I/O’s. This
device has an automatic power-down mode feature when
deselected.
Writing to the device is accomplished by taking Chip
Enable 1 (CE1) with Write Enable (WE) LOW, and Chip
Enable 2 (CE2) HIGH. Reading from the device is per-
formed by taking Chip Enable 1 (CE1) with Output
Enable (OE) LOW while Write Enable (WE) and Chip
Enable 2 (CE2) is HIGH. The I/O pins are placed in a
high-impedance state when the device is deselected: the
outputs are disabled during a write cycle.
TheV62C2802048LL comes with a 1V data retention fe-
ature and Lower Standby Power. The V62C2802048L is
avalable in a 32-pin 8 x 20 mm TSOP1 / STSOP 8x13.4 mm
and CSP type 48-fpBGA packages.
Logic Block Diagram
32-Pin TSOP1 / STSOP
(CSP_BGA See next page)
A
11
A
9
A
8
INPUT BUFFER
ROW DECODER
SENSE AMP
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A9
A
13
WE
CE
2
I/O8
Cell Array
A
15
Vcc
A17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
I/O1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A
10
CE1
I/O
8
I/O
7
I/O
6
I/O
5
I/O
4
GND
I/O
3
I/O
2
I/O
1
A
0
A
1
A
2
A
3
COLUMN DECODER
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
CONTROL
CIRCUIT
OE
WE
CE1
CE2
1
REV. 1.2
May
2001 V62C2802048L(L)

V62C2802048LL-100VI Related Products

V62C2802048LL-100VI V62C2802048LL-55B V62C2802048LL-55BI V62C2802048LL-55TI
Description Standard SRAM, 256KX8, 100ns, CMOS, PDSO32, 8 X 13.40 MM, PLASTIC, STSOP-32 Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48 Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48 Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC )
Parts packaging code TSOP BGA BGA TSOP1
package instruction TSOP1, TSSOP32,.56,20 TFBGA, BGA36,6X8,30 TFBGA, BGA36,6X8,30 TSOP1, TSSOP32,.8,20
Contacts 32 48 48 32
Reach Compliance Code unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 100 ns 55 ns 55 ns 55 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G32 R-PBGA-B48 R-PBGA-B48 R-PDSO-G32
JESD-609 code e0 e0 e0 e0
length 12.4 mm 12 mm 12 mm 18.4 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 32 48 48 32
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
organize 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TFBGA TFBGA TSOP1
Encapsulate equivalent code TSSOP32,.56,20 BGA36,6X8,30 BGA36,6X8,30 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.5 V 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum standby current 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Minimum standby current 1 V 1 V 1 V 1 V
Maximum slew rate 0.02 mA 0.035 mA 0.035 mA 0.035 mA
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.2 V 2.2 V 2.2 V 2.2 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING BALL BALL GULL WING
Terminal pitch 0.5 mm 0.75 mm 0.75 mm 0.5 mm
Terminal location DUAL BOTTOM BOTTOM DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8 mm 9 mm 9 mm 8 mm
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