HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, METAL SEALED, CERAMIC, DFP-16
| Parameter Name | Attribute value |
| Parts packaging code | DFP |
| package instruction | DFP, FL16,.3 |
| Contacts | 16 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| series | HC/UH |
| JESD-30 code | R-CDFP-F16 |
| JESD-609 code | e4 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | OTHER DECODER/DRIVER |
| MaximumI(ol) | 0.006 A |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output polarity | INVERTED |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Prop。Delay @ Nom-Su | 27 ns |
| propagation delay (tpd) | 27 ns |
| Certification status | Not Qualified |
| Filter level | 38535V;38534K;883S |
| Maximum seat height | 2.92 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | GOLD |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| width | 6.73 mm |
| Base Number Matches | 1 |
| 5962R9580401VXC | 5962R9580401V9A | |
|---|---|---|
| Description | HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, METAL SEALED, CERAMIC, DFP-16 | HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, UUC16, 0.106 X 0.108 X 0.019 INCH, DIE-16 |
| Parts packaging code | DFP | DIE |
| package instruction | DFP, FL16,.3 | DIE, |
| Contacts | 16 | 16 |
| Reach Compliance Code | compli | unknown |
| ECCN code | EAR99 | EAR99 |
| series | HC/UH | HC/UH |
| JESD-30 code | R-CDFP-F16 | R-XUUC-N16 |
| JESD-609 code | e4 | e0 |
| Number of functions | 2 | 2 |
| Number of terminals | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Output polarity | INVERTED | INVERTED |
| Package body material | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| encapsulated code | DFP | DIE |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | UNCASED CHIP |
| propagation delay (tpd) | 27 ns | 27 ns |
| Certification status | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | GOLD | TIN LEAD |
| Terminal form | FLAT | NO LEAD |
| Terminal location | DUAL | UPPER |
| total dose | 100k Rad(Si) V | 100k Rad(Si) V |
| Base Number Matches | 1 | 1 |