Enhanced
Features
Memory Systems Inc.
DM2M36SJ/DM2M32SJ
2Mbx36/2Mbx32 Enhanced DRAM SIMM
Product Specification
Architecture
The DM2M36SJ
Active Cache Pages
achieves 2Mb x 36 density
s
Fast DRAM Array for 30ns Access to Any New Page
by mounting 18 1Mb x 4
s
Write Posting Register for 12ns Random Writes and Burst Writes
EDRAMs, packaged in 28-
Within a Page (Hit or Miss)
pin plastic SOJ packages, on
s
2KByte Wide DRAM to SRAM Bus for 113.6 Gigabytes/Sec Cache Fill
both sides of the multi-layer
s
On-chip Cache Hit/Miss Comparators Maintain Cache Coherency on Writes
substrate. Sixteen DM2202
s
Hidden Precharge and Refresh Cycles
and two DM2212 devices
s
Extended 64ms Refresh Period for Low Standby Power
provide data and parity
s
Standard CMOS/TTL Compatible I/O Levels and +5 or 3.3V Volt Supply
storage. The DM2M32SJ
s
Compatibility with JEDEC 2M x 36 DRAM SIMM Configuration
contains 16 DM2202
Allows Performance Upgrade in System
devices for data only and
s
Low Power, Self Refresh Option
s
Industrial Temperature Range Option
parity memory is not
included.
Description
The EDRAM memory
module architecture is very
The Enhanced Memory Systems 8MB EDRAM SIMM module
provides a single memory module solution for the main memory or
similar to a standard 8MB DRAM module with the addition of an
local memory of fast PCs, workstations, servers, and other high
integrated cache and on-chip control which allows it to operate
performance systems. Due to its fast 12ns cache row register, the
much like a page mode or static column DRAM.
EDRAM memory module supports zero-wait-state burst read
The EDRAM’s SRAM cache is integrated into the DRAM array as
operations at up to 50MHz bus rates in a non-interleave configuration tightly coupled row registers. Memory reads always occur from the
and 100MHz bus rates with a two-way interleave configuration.
cache row register. When the on-chip comparator detects a page hit,
On-chip write posting and fast page mode operation supports
12ns write and burst write operations. On a cache miss, the fast DRAM only the SRAM is accessed and data is available in 12ns from column
array reloads the entire 2KByte cache over a 2KByte-wide bus in 18ns address. When a page read miss is detected, the entire new DRAM
row is loaded into the cache and data is available at the output all
for an effective bandwidth of 113.6 Gbytes/sec. This means very low
within 30ns from row enable. Subsequent reads within the page
latency and fewer wait states on a cache miss than a non-integrated
cache/DRAM solution. The JEDEC compatible 72-bit SIMM
(burst reads or random reads) will continue at 12ns cycle time.
configuration allows a single memory controller to be designed to
Since reads occur from the SRAM cache, the DRAM precharge can
support either JEDEC slow DRAMs or high speed EDRAMs to provide a occur simultaneously without degrading performance. The on-chip
simple upgrade path to higher system performance.
refresh counter with independent refresh
bus allows the EDRAM to be refreshed
Functional Diagram
during cache reads.
Memory writes are internally posted
A
0-8
Column
/CAL
0-3,P
Add
Column Decoder
in 12ns and directed to the DRAM array.
Latch
During a write hit, the on-chip address
512 X 36 Cache (Row Register) X 2
11-Bit
comparator activates a parallel write path
Comp
Sense Amps
to the SRAM cache to maintain coherency.
/G
& Column Write Select
I/O
The EDRAM delivers 12ns cycle page
Last
Control
A
0-10
Row
DQ
0-35
and
mode memory writes. Memory writes do
Read
Data
Add
Latches
not affect the contents of the cache row
Latch
/S
0,1
register except during a cache hit.
Memory
Row
By integrating the SRAM cache as
Array
/WE
Add
2048 x 512 x 36 x 2
Latch
row registers in the DRAM array and
keeping the on-chip control simple, the
EDRAM is able to provide superior
V
performance over standard slow DRAMs.
A
0-9
C
/F
Row Add
V
By eliminating the need for SRAMs and
Refresh
and
W/R
Counter
Refresh
cache controllers, system cost, board
Control
/RE
0,2,3
space, and power can all be reduced.
s
4KByte SRAM Cache Memory for 12ns Random Reads Within Two
Row Decoder
CC
1-18
SS
The information contained herein is subject to change without notice.
Enhanced reserves the right to change or discontinue this product without notice.
© 1996 Enhanced Memory Systems Inc.,
1850 Ramtron Drive, Colorado Springs, CO
Telephone
(800) 545-DRAM;
Fax
(719) 488-9095; http://www.csn.net/ramtron/enhanced
80921
38-2104-001
Functional Description
The EDRAM is designed to provide optimum memory
performance with high speed microprocessors. As a result, it is
possible to perform simultaneous operations to the DRAM and
SRAM cache sections of the EDRAM. This feature allows the EDRAM
to hide precharge and refresh operation during SRAM cache reads
and maximize SRAM cache hit rate by maintaining valid cache
contents during write operations even if data is written to another
memory page. These new functions, in conjunction with the faster
basic DRAM and cache speeds of the EDRAM, minimize processor
wait states.
t
AC
or t
GQV
. Since no DRAM activity is initiated, /RE can be brought
high after time t
RE1
, and a shorter precharge time, t
RP1
, is required.
It is possible to access additional SRAM cache locations by
providing new column addresses to the multiplex address inputs.
New data is available at the output at time t
AC
after each column
address change in static column mode. During read cycles, it is
possible to operate in either static column mode with /CAL=high or
page mode with /CAL clocked to latch the column address. In page
mode, data valid is determined by either t
AC
or t
CQV
.
DRAM Read Miss
If a DRAM read request is initiated by clocking /RE with W/R
low and /F and /CAL high, the EDRAM will compare the new row
address to the LRR address latch (an 11-bit latch loaded on each
EDRAM Basic Operating Modes
/RE active read cycle). If the row address does not match the LRR,
The EDRAM operating modes are specified in the table below.
the requested data is not in SRAM cache and a new row must be
fetched from the DRAM. The EDRAM will load the new row data into
the SRAM cache and update the LRR latch. The data at the specified
Hit and Miss Terminology
column address is available at the output pins at the greater of times
In this datasheet, “hit” and “miss” always refer to a hit or miss
t , t , and t . It is possible to bring /RE high after time t since
RAC AC
GQV
RE
to the page of data contained in the SRAM cache row register. This is
the new row data is safely latched into SRAM cache. This allows the
always equal to the contents of the last row that was read from (as
EDRAM to precharge the DRAM array while data is accessed from
SRAM cache. It is possible to access additional SRAM cache
modified by any write hit data). Writing to a new page does not
locations by providing new column addresses to the multiplex
cause the cache to be modified.
address inputs. New data is available at the output at time t
AC
after
each column address change in static column mode. During read
Bank Selection
The 8MByte EDRAM SIMM has two separate 4MByte banks on
cycles, it is possible to operate in either static column mode with
/CAL=high or page mode with /CAL clocked to latch the column
one module. The two banks share common data, multiplexed
address, and control signals with the exception of /RE and /S. Bank
address. In page mode, data valid is determined by either t
AC
or
t
CQV.
selection is performed by using both /RE and /S to select a bank.
The use of /S to select a bank is
required
on the 8MByte SIMM
DRAM Write Hit
because /G is common between the two banks. If /S is grounded
If a DRAM write request is initiated by clocking /RE while W/R
(i.e., not used to control bank selection), an output buffer conflict
and /F are high, the EDRAM will compare the new row address to the
LRR address latch (an 11-bit address latch loaded on each /RE active
between the two banks
will
occur when /G is enabled. It is also
read). If the row address matches, the EDRAM will write data to both
necessary to clock the /RE signal for each bank separately since
the DRAM array and selected SRAM cache simultaneously to maintain
clocking /RE with /S disabled is
not
allowed (see “Unallowed
coherency. The write address and data are posted to the DRAM as soon
Mode” description).
as the column address is latched by bringing /CAL low and the write
DRAM Read Hit
data is latched by bringing /WE low (both /CAL and /WE must be high
If a DRAM read request is initiated by clocking /RE with W/R
when initiating the write cycle with the falling edge of /RE). The write
low and /F and /CAL high, the EDRAM will compare the new row
address and data can be latched very quickly after the fall of /RE (t
RAH
address to the last row read address latch (LRR; an 11-bit latch
+ t
ASC
for the column address and t
DS
for the data). During a write
loaded on each /RE active read cycle). If the row address matches
burst sequence, the second write data can be posted at time t
RSW
after
the LRR, the requested data is already in the SRAM cache and no
/RE. Subsequent writes within a page can occur with write cycle time
DRAM memory reference is initiated. The data specified by the
t
PC
. With /G enabled and /WE disabled, it is possible to perform cache
column address is available at the output pins at the greater of times read operations while the /RE is activated in write hit mode. This allows
EDRAM Basic Operating Modes
Function
Read Hit
Read Miss
Write Hit
Write Miss
Internal Refresh
Low Power Standby
Unallowed Mode
Low Power Self-Refresh
Option
/S
L
L
L
L
X
H
H
H
/RE
↓
↓
↓
↓
↓
H
L
↓
W/R
L
L
H
H
X
X
X
H
/F
H
H
H
H
L
X
H
H
/CAL
H
H
H
H
X
H
X
L
/WE
X
X
H
H
X
H
X
H
A
0-10
Row = LRR
Row
≠
LRR
Row = LRR
Row
≠
LRR
X
X
X
X
Comment
No DRAM Reference, Data in Cache
DRAM Row to Cache
Write to DRAM and Cache, Reads Enabled
Write to DRAM, Cache Not Updated, Reads Disabled
Cache Reads Enabled
Standby Current
Unallowed Mode (Except -L Option)
Standby Current, Internal Refresh Clock (-L Option)
H = High; L = Low; X = Don’t Care;
↓
= High-to-Low Transition; LRR = Last Row Read
1-84
read-modify-write, write-verify, or random read-write sequences
within the page with 12ns cycle times (the first read cannot complete
until after time t
RAC2
). At the end of a write sequence (after /CAL and
/WE are brought high and t
RE
is satisfied), /RE can be brought high to
precharge the memory. It is possible to perform cache reads
concurrently with precharge. During write sequences, a write operation
is not performed unless both /CAL and /WE are low. As a result, the
/CAL input can be used as a byte write select in multi-chip systems. If
/CAL is not clocked on a write sequence, the memory will perform a
/RE only refresh to the selected row and data will remain unmodified.
DRAM Write Miss
If a DRAM write request is initiated by clocking /RE while W/R
and /F are high, the EDRAM will compare the new row address to the
LRR address latch (an 11-bit latch loaded on each /RE active read
cycle). If the row address does not match, the EDRAM will write data
to the DRAM array only and contents of the current cache is not
modified. The write address and data are posted to the DRAM as soon
as the column address is latched by bringing /CAL low and the write
data is latched by bringing /WE low (both /CAL and /WE must be high
when initiating the write cycle with the falling edge of /RE). The write
address and data can be latched very quickly after the fall of /RE (t
RAH
+ t
ASC
for the column address and t
DS
for the data). During a write
burst sequence, the second write data can be posted at time t
RSW
after
/RE. Subsequent writes within a page can occur with write cycle time
t
PC
. During a write miss sequence, cache reads are inhibited and the
output buffers are disabled (independently of /G) until time t
WRR
after
/RE goes high. At the end of a write sequence (after /CAL and /WE are
brought high and t
RE
is satisfied), /RE can be brought high to
precharge the memory. It is possible to perform cache reads
concurrently with the precharge. During write sequences, a write
operation is not performed unless both /CAL and /WE are low. As a
result, /CAL can be used as a byte write select in multi-chip systems. If
/CAL is not clocked on a write sequence, the memory will perform a
/RE only refresh to the selected row and data will remain unmodified.
/RE Inactive Operation
It is possible to read data from the SRAM cache without clocking
/RE. This option is desirable when the external control logic is capable
of fast hit/miss comparison. In this case, the controller can avoid the
time required to perform row/column multiplexing on hit cycles. This
capability also allows the EDRAM to perform cache read operations
during precharge and refresh cycles to minimize wait states. It is only
necessary to select /S for the selected bank (/S
0
or /S
1
) and /G and
provide the appropriate column address to read data (as shown in the
table below). The row address of the SRAM cache accessed without
clocking /RE will be specified by the LRR address latch loaded during
the last /RE active read cycle. To perform a cache read in static column
mode, /CAL is held high, and the cache contents at the specified column
address will be valid at time t
AC
after address is stable. To perform a
cache read in page mode, /CAL is clocked to latch the column address.
The cache data is valid at time t
AC
after the column address is setup to
/CAL.
Write-Per-Bit Operation
The DM2M36SJ EDRAM SIMM provides a write-per-bit capability
to selectively modify individual parity bits (DQ
8,17,26,35
) for byte write
operations. The parity devices (DM2212) are selected via /CAL
P
. Data
bits do not require or support write-per-bit capability. Byte write
selection to non-parity bits is accomplished via /CAL
0-3
. The bits to be
written are determined by a bit mask data word which is placed on the
parity I/O data pins prior to clocking /RE. The logic one bits in the
mask data select the bits to be written. As soon as the mask is latched
by /RE, the mask data is removed and write data can be placed on the
databus. The mask is only specified on the /RE transition. During page
mode burst write operations, the same mask is used for all write
operations.
Internal Refresh
If /F is active (low) on the assertion of /RE, an internal refresh
cycle is executed. This cycle refreshes the row address supplied by an
internal refresh counter. This counter is incremented at the end of the
cycle in preparation for the next /F refresh cycle. At least 1,024 /F
cycles must be executed every 64ms. /F refresh cycles can be hidden
because cache memory can be read under column address control
throughout the entire /F cycle. /F cycles are the only active cycles
during which /S can be disabled.
/CAL Before /RE Refresh (“/CAS Before /RAS”)
/CAL before /RE refresh, a special case of internal refresh, is
discussed in the “Reduced Pin Count Operation” section below.
/RE Only Refresh Operation
Although /F refresh using the internal refresh counter is the
recommended method of EDRAM refresh, it is possible to perform an
/RE only refresh using an externally supplied row address. /RE refresh
is performed by executing a
write cycle
(W/R and /F are high) where
/CAL is not clocked. This is necessary so that the current cache
contents and LRR are not modified by the refresh operation. All
combinations of addresses A
0-9
must be sequenced every 64ms
refresh period. A
10
does not need to be cycled. Read refresh cycles are
not allowed because a DRAM refresh cycle does not occur when a
read refresh address matches the LRR address latch.
+3.3 Volt Power Supply Operation
If the +3.3 volt power supply option is specified, the EDRAM will
operate from a +3.3 volt +0.3 volt power supply and all inputs and
outputs will have LVTTL/LVCMOS compatible signal levels. The +3.3
volt EDRAM will not accept input levels which exceed the power
supply voltage. If mixed I/O levels are expected in your system, please
specify the +5 volt version of the EDRAM.
Low Power Mode
The EDRAM enters its low power mode when /S is high. In this
mode, the internal DRAM circuitry is powered down to reduce
standby current.
Low Power, Self-Refresh Option
When the low power, self refresh mode option is specified when
ordering the EDRAM, the EDRAM enters this mode when /RE is
clocked while /S, W/R, /F, and /WE are high; and /CAL is low. In this
mode, the power is turned off to all I/O pins except /RE to minimize
chip power, and an on-board refresh clock is enabled to perform self-
refresh cycles using the on-board refresh counter. The EDRAM
remains in this low power mode until /RE is brought high again to
terminate the mode. The EDRAM /RE input must remain high for
t
RP2
following exit from self-refresh mode to allow any on-going
internal refresh to terminate prior to the next memory operation.
Function
Cache Read (Static Column)
Cache Read (Page Mode)
/S
L
L
/G
L
L
/CAL
H
¤
A
0-8
Column Address
Column Address
H = High; L = Low; X = Don’t Care;
¤
= Transitioning
1-85
Pinout
Interconnect
Pin No. Function (Component Pin)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
GND
DQ
0
DQ
18
DQ
1
DQ
19
DQ
2
DQ
20
DQ
3
DQ
21
C (8,21,28)
U1,10 (27)
U2,11 (24)
U1,10 (26)
U2,11 (25)
U1,10 (25)
U2,11 (26)
U1,10 (24)
U2,11 (27)
Ground
Byte 1 I/O 1
Byte 3 I/O 1
Byte 1 I/O 2
Byte 3 I/O 2
Byte 1 I/O 3
Byte 3 I/O 3
Byte 1 I/O 4
Byte 3 I/O 4
V
CC
V
CC
Address
Address
Address
Address
Address
Address
Address
Address
Byte 1 I/O 5
Byte 3 I/O 5
Byte 1 I/O 6
Byte 3 I/O 6
Byte 1 I/O 7
Byte 3 I/O 7
Byte 1 I/O 8
Byte 3 I/O 8
Address
Ground
V
CC
Address
Address
Bank 1 Row Enable
Bank 0 Row Enable (Bytes 3,4, Parity)
Parity I/O for Byte 3
Parity I/O for Byte 1
Organization
Interconnect
Pin No. Function (Component Pin)
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
DQ
17
*
DQ
35
*
GND
/CAL
0
/CAL
2
/CAL
3
/CAL
1
/RE
0
/S
1
/CAL
P
*
/WE
W/R
DQ
9
DQ
27
DQ
10
DQ
28
DQ
11
DQ
29
DQ
12
DQ
30
DQ
13
DQ
31
+5/3.3 V
DQ
32
DQ
14
DQ
33
DQ
15
DQ
34
DQ
16
+5/3.3 V
/G
/F
/S
0
PD
GND
GND
U5,14 (25)
U5,14 (24)
C (8,21,28)
U1,3,10,12 (16)
U2,4,11,13 (16)
U7,8,16,17 (16)
U6,9,15,18 (16)
U1,3,6,9 (6)
U10-18 (19)
U5,14 (16)
C (20)
C (17)
U6,15 (27)
U7,16 (27)
U6,15 (26)
U7,16 (26)
U6,15 (25)
U7,16 (25)
U6,15 (24)
U7,16 (24)
U9,18 (24)
U8,17 (24)
C (7,14,22)
U8,17 (26)
U9,18 (25)
U8,17 (25)
U9,18 (26)
U8,17 (24)
U9,18 (27)
C (7,14,22)
C (23)
C (18)
U1-9 (19)
Signal GND
C (8,21,28)
C (8,21,28)
Organization
Parity I/O for Byte 2
Parity I/O for Byte 4
Ground
Byte 1 Column Address Latch
Byte 3 Column Address Latch
Byte 4 Column Address Latch
Byte 2 Column Address Latch
Bank 0 Row Enable (Bytes 1,2)
Chip Select Bank 1
Parity Column Address Latch
Write Enable
W/R Mode Control
Byte 2 I/O 1
Byte 4 I/O 1
Byte 2 I/O 2
Byte 4 I/O 2
Byte 2 I/O 3
Byte 4 I/O 3
Byte 2 I/O 4
Byte 4 I/O 4
Byte 2 I/O 5
Byte 4 I/O 5
V
CC
Byte 4 I/O 6
Byte 2 I/O 6
Byte 4 I/O 7
Byte 2 I/O 7
Byte 4 I/O 8
Byte 2 I/O 8
V
CC
Output Enable
Refresh Mode Control
Chip Select Bank 0
Presence Detect
Ground
Ground
*No Connect for DM2M32SJ
+5/3.3 V C (7,14,22)
+5/3.3 V C (7,14,22)
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
10
DQ
4
DQ
22
DQ
5
DQ
23
DQ
6
DQ
24
DQ
7
DQ
25
A
7
GND
C (1)
C (2)
C (12)
C (3)
C (4)
C (5)
C (9)
C (15)
U3,12 (27)
U4,13 (24)
U3,12 (26)
U4,13 (25)
U3,12 (25)
U4,13 (26)
U3,12 (24)
U4,13 (27)
C (10)
C (8,21,28)
+5/3.3 V C (7,14,22)
A
8
A
9
/RE
3
/RE
2
DQ
26
*
DQ
8
*
C (11)
C (13)
U10-18 (6)
U2,4,5,7,8 (6)
U5,14 (27)
U5,14 (26)
C = Common to All Memory Chips, U1 = Chip 1, etc.
1-86
Interconnect Diagram — Bank 0 (Components Mounted on Front Side)
DQ 13
DQ 18
DQ 22
DQ 31
DQ 4
10
11
12
14
15
16
17
19
20
21
23
24
25
26
27
28
29
30
32
33
34
/CAL
DQ0
DQ1
DQ2
DQ3
U6
U3
Byte 2
DM2202J
1Mb x 4
DM2202J
1Mb x 4
DM2202J
1Mb x 4
48
47
68
69
67
/CAL
/RE
16
/CAL
/RE
16
16
40
43
41
42
46
44
34
/CAL0
/CAL1
/CAL2
/CAL3
/CALP
/RE0
/RE2
/CAL0
/CAL1
/CAL2
/CAL3
/CALP
+5V (3.3V)
10
11
30
59
66
1
29
39
71
72
70
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VSS
VSS
VSS
PD
C1
C2
C3
6
C4
C5
6
C6
6
W/R
/WE
/F
/S0
/G
17
20
18
19
23
W/R
/WE
/F
/S
/G
DM2202J
1Mb x 4
DM2202J
1Mb x 4
/CAL
/RE
12
13
14
15
16
17
18
28
31
32
19
16
/CAL
/RE
EDRAM
16
EDRAM
C7
C8
6
C9
*DM2212 is not present on the DM2M32SJ.
1-87
6
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
1
2
12
3
4
5
9
10
11
13
15
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
DM2202J
1Mb x 4
/CAL
/RE
16
/CAL
/RE
16
U1
Byte 1
EDRAM
/CAL
/RE
16
/CAL
/RE
16
EDRAM
6
6
EDRAM
6
EDRAM
6
EDRAM
/RE
2
4
6
8
20
22
24
26
36
49
51
53
55
57
61
63
65
37
3
5
7
9
21
23
25
27
35
50
52
54
56
58
60
62
64
38
27
26
25
24
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ 35
DQ 0
Edge
Connecter
J1
1
2
3
5
6
7
8
9
27
26
25
DQ0
DQ1
DQ2
27
26
25
DQ0
DQ1
DQ2
27
26
25
24
DQ3
24
DQ0
DQ1
DQ2
27
26
25
24
DQ3
U8
U7
Parity
U5
*
DM2212J
1Mb x 4
DQ0
DQ1
DQ2
27
26
25
24
DQ3
DQ3
24
+5V (3.3V)
VCC 7
VCC 14
VCC 22
8
VSS 21
VSS 28
VSS
DQ0
DQ1
DQ2
27
26
25
24
DQ3
DQ0
DQ1
DQ2
27
26
25
24
DQ3
U4
U2
Byte 4
DM2202J
1Mb x 4
DM2202J
1Mb x 4
DQ0
DQ1
DQ2
DQ3
27
26
25
24
EDRAM
DQ0
DQ1
DQ2
DQ3
U9
Byte 3
EDRAM
Industrial Control Electronics
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