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74LVT16244BEV/G:55

Description
buffers & line drivers 3.3V buf/LN drvr
Categorylogic    logic   
File Size212KB,18 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVT16244BEV/G:55 Overview

buffers & line drivers 3.3V buf/LN drvr

74LVT16244BEV/G:55 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeBGA
package instructionVFBGA, BGA56,6X10,25
Contacts56
Manufacturer packaging codeSOT702-1
Reach Compliance Codecompli
Control typeENABLE LOW
seriesLVT
JESD-30 codeR-PBGA-B56
length7 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.064 A
Humidity sensitivity level2
Number of digits4
Number of functions4
Number of ports2
Number of terminals56
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA56,6X10,25
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTRAY
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su3.2 ns
propagation delay (tpd)4 ns
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width4.5 mm
Base Number Matches1
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Rev. 11 — 1 March 2012
Product data sheet
1. General description
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for
V
CC
operation at 3.3 V.
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.
2. Features and benefits
16-bit bus interface
3-state buffers
Output capability: +64 mA and
32
mA
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
Power-up 3-state
Live insertion and extraction permitted
No bus current loading when output is tied to 5 V bus
Latch-up protection
JESD78B Class II exceeds 500 mA
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LVT16244BDL
74LVTH16244BDL
74LVT16244BDGG
74LVTH16244BDGG
74LVT16244BEV
74LVT16244BBX
74LVTH16244BBX
40 C
to +85
C
40 C
to +125
C
VFBGA56
HXQFN60
40 C
to +85
C
TSSOP48
40 C
to +85
C
Name
SSOP48
Description
plastic shrink small outline package; 48 leads;
body width 7.5 mm
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
plastic very thin fine-pitch ball grid array
package; 56 balls; body 4.5
7
0.65 mm
Version
SOT370-1
SOT362-1
SOT702-1
Type number
plastic compatible thermal enhanced extremely SOT1134-2
thin quad flat package; no leads; 60 terminals;
body 4
6
0.5 mm

74LVT16244BEV/G:55 Related Products

74LVT16244BEV/G:55 74LVT16244BDL,112 74LVT16244BEV/G,55 74LVT16244BDGG,112 74LVTH16244BDL,118 74LVT16244BEV/G,51
Description buffers & line drivers 3.3V buf/LN drvr buffers & line drivers 3.3V 16-bit buf/drvr inv 3S buffers & line drivers 3.3V buf/LN drvr buffers & line drivers IC buff dvr tri-ST 16bit buffers & line drivers 3.3V buf/ldrvr buffers & line drivers 3.3V buf/LN drvr
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconduc NXP Semiconduc
Maker NXP NXP NXP NXP NXP NXP
Parts packaging code BGA SSOP BGA TSSOP SSOP BGA
package instruction VFBGA, BGA56,6X10,25 SSOP, SSOP48,.4 VFBGA, BGA56,6X10,25 TSSOP, TSSOP48,.3,20 SSOP, SSOP48,.4 VFBGA, BGA56,6X10,25
Contacts 56 48 56 48 48 56
Manufacturer packaging code SOT702-1 SOT370-1 SOT702-1 SOT362-1 SOT370-1 SOT702-1
Reach Compliance Code compli compli compli compliant compli compli
Control type ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
series LVT LVT LVT LVT LVT LVT
JESD-30 code R-PBGA-B56 R-PDSO-G48 R-PBGA-B56 R-PDSO-G48 R-PDSO-G48 R-PBGA-B56
length 7 mm 15.875 mm 7 mm 12.5 mm 15.875 mm 7 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.064 A 0.064 A 0.064 A 0.064 A 0.064 A 0.064 A
Humidity sensitivity level 2 1 2 1 1 2
Number of digits 4 4 4 4 4 4
Number of functions 4 4 4 4 4 4
Number of ports 2 2 2 2 2 2
Number of terminals 56 48 56 48 48 56
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA SSOP VFBGA TSSOP SSOP VFBGA
Encapsulate equivalent code BGA56,6X10,25 SSOP48,.4 BGA56,6X10,25 TSSOP48,.3,20 SSOP48,.4 BGA56,6X10,25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TRAY TUBE TRAY TUBE TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 NOT SPECIFIED 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
propagation delay (tpd) 4 ns 4 ns 4 ns 4 ns 4 ns 4 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1 mm 2.8 mm 1 mm 1.2 mm 2.8 mm 1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING BALL GULL WING GULL WING BALL
Terminal pitch 0.65 mm 0.635 mm 0.65 mm 0.5 mm 0.635 mm 0.65 mm
Terminal location BOTTOM DUAL BOTTOM DUAL DUAL BOTTOM
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED 30 30
width 4.5 mm 7.5 mm 4.5 mm 6.1 mm 7.5 mm 4.5 mm
Base Number Matches 1 1 1 1 1 1
Is it Rohs certified? conform to conform to - conform to conform to conform to
Prop。Delay @ Nom-Su 3.2 ns 3.2 ns 3.2 ns - 3.2 ns 3.2 ns

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