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MN4012B

Description
NAND Gate, 4000/14000/40000 Series, 2-Func, 4-Input, CMOS, PDIP14, PLASTIC, DIP-14
Categorylogic    logic   
File Size245KB,3 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Download Datasheet Parametric Compare View All

MN4012B Overview

NAND Gate, 4000/14000/40000 Series, 2-Func, 4-Input, CMOS, PDIP14, PLASTIC, DIP-14

MN4012B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPanasonic
Parts packaging codeDIP
package instructionDIP, DIP14,.3
Contacts14
Reach Compliance Codeunknown
series4000/14000/40000
JESD-30 codeR-PDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Number of functions2
Number of entries4
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5/15 V
propagation delay (tpd)210 ns
Certification statusNot Qualified
Schmitt triggerNO
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
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MN4012B Related Products

MN4012B MN4012BS
Description NAND Gate, 4000/14000/40000 Series, 2-Func, 4-Input, CMOS, PDIP14, PLASTIC, DIP-14 NAND Gate, 4000/14000/40000 Series, 2-Func, 4-Input, CMOS, PDSO14, SOP-14
Is it Rohs certified? incompatible incompatible
Maker Panasonic Panasonic
Parts packaging code DIP SOIC
package instruction DIP, DIP14,.3 SOP, SOP14,.25
Contacts 14 14
Reach Compliance Code unknown unknown
series 4000/14000/40000 4000/14000/40000
JESD-30 code R-PDIP-T14 R-PDSO-G14
JESD-609 code e0 e0
Logic integrated circuit type NAND GATE NAND GATE
Number of functions 2 2
Number of entries 4 4
Number of terminals 14 14
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP
Encapsulate equivalent code DIP14,.3 SOP14,.25
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5/15 V 5/15 V
propagation delay (tpd) 210 ns 210 ns
Certification status Not Qualified Not Qualified
Schmitt trigger NO NO
surface mount NO YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
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