D
WIMA MP 3-X2
Metallized Paper (MP)
RFI-Capacitors Class X2
PCM 10 mm to 27.5 mm
Special Features
˜
Particularly high reliability against
active and passive flammability
˜
Excellent self-healing as well as
high voltage strength
˜
High degree of interference
suppression due to good
attenuation and low ESR
˜
For temperatures up to +110° C
˜
According to RoHS 2002/95/EC
Electrical Data
Capacitance range:
1000 pF to 1.0
m
F (E12-values on request)
Rated voltages:
250 VAC, 275 VAC
Capacitance tolerances:
±20%
Operating temperature range:
–40) C to +110) C
Climatic test category:
40/110/56/C in accordance with IEC
Insulation resistance
at +20+ C:
C
!
0.33
mF:
&
12 x 10
3
M¸
C
>
0.33
mF:
&
4000 sec (M¸ x
mF)
Measuring voltage: 100 V/1 min.
Dissipation factors:
tan
d
!
13 x 10
–3
at 1 kHz and +20+ C
Test specifications:
In accordance with DIN EN 132 400
Approvals:
Country
Germany
Authority
VDE
Specification
DIN EN 132 400
IEC 60384-14/2
UL 1283
C 22.2 No. 8
Maximum pulse rise time:
Capacitance
pF/mF
1000
1500
2200 ... 4700
6800 ... 0.022
0.033 ... 0.047
0.068 ... 1.0
Pulse rise time V/msec
max. operation
1000
600
450
300
200
100
Typical Applications
Class X2 RFI applications to meet
EMC regulations
˜
Capacitors connected to the mains
between phase and neutral or
phase and phase conductors
˜
Installation category II in
accordance with IEC 60664,
pulse peak voltage
!
2.5 kV
for pulses equal to the rated voltage,
U
pp
= 390 V
Test voltage:
2700 VDC, 2 sec.
Reliability:
Operational life
>
300 000 hours
Failure rate
<
1 fit (0.5 x U
r
and 40) C)
Symbol
V
D E
EN 132 400
Approval-No.
250 VAC
89749
Approval-No.
275 VAC
89749
Construction
Dielectric:
Paper, epoxy resin impregnated
Capacitor electrodes:
Vacuum-deposited
Internal construction:
USA
Canada
UL
CSA
E 100438
LR 93312-1
E 100438
LR 93312-1
Capacitor paper
Vacuum-deposited
electrode
Metal contact layer
(schoopage)
Terminating wire
Mounting Recommendation
To minimize or avoid shock and/or
vibration stresses to terminating wires
and solder connections we recommend to
fix voluminous resin-potted MP capacitors
as from e.g. PCM 22.5 mm in an
appropriate way since for constructional
reasons they do not sit tight on the
board.
Packing
Available taped and reeled up to and
including PCM 22.5 mm.
Detailed taping information and graphs
at the end of the catalogue.
For further details and graphs please
refer to Technical Information.
Encapsulation:
Self-extinguishing epoxy resin, UL 94 V-0,
metal foil
Terminations:
Tinned wire.
Marking:
Marking: Black on Silver.
09.06
93
D
Recommendation for Processing
and Application of
Through-Hole Capacitors
Soldering Process
A preheating of through-hole WIMA
capacitors is allowed for temperatures
T
max
<
100 ° C.
In practice a preheating duration of
t
<
5 min. has been proven to be best.
Single wave soldering
Soldering bath temperature: T
<
260 ° C
Immersion time:
t
<
5 sec
Double wave soldering
Soldering bath temperature: T
<
260 ° C
Immersion time:
2 x t
<
3 sec
Wave soldering
T
260
240
220
200
180
160
140
120
100
80
60
40
20
[°C]
see detail-
enlargement
2s
3s
10 s
t
30
60
90
120
150
180
210
240 [sec]
Temperature/time graph for the maximum permissible solder bath
temperature for the wave soldering of through-hole WIMA capacitors
WIMA Quality and Environmental Philosophy
ISO 9001:2000 Certification
ISO 9001:2000 is an international basic
standard of quality assurance systems for
all branches of industry. The approval
according to ISO 9001:2000 of our
factories by the VDE inspectorate certifies
that organisation, equipment and moni-
toring of quality assurance in our factories
correspond to internationally recognized
standards.
WIMA Environmental Policy
All WIMA capacitors, irrespective of
whether through-hole devices or SMD,
are made of environmentally friendly
materials. Neither during manufacture
nor in the product itself any toxic sub-
stances are used, e.g.
–
–
–
–
–
Lead
PCB
CFC
Hydrocarbon chloride
Chromium 6+
–
–
–
–
–
PBB/PBDE
Arsenic
Cadmium
Mercury
etc.
RoHS Compliance
According to the RoHS Directive 2002/95/EC
certain hazardous substances like e.g. lead,
cadmium, mercury must not be used any
longer in electronic equipment as of July 1st,
2006. For the sake of the environment WIMA
has refraind from using such substances since
years already.
WIMA WPCS
The WIMA Process Control System (WPCS)
is a quality surveillance and optimization
system developed by WIMA. WPCS is a
major part of the quality-oriented WIMA
production. Points of application of WPCS
during production process:
incoming material inspection
metallization
film inspection
schoopage
pre-healing
lead attachment
cast resin preparation/
encapsulation
”
100% final inspection
”
AQL check
”
”
”
”
”
”
”
We merely use pure, recyclable materials
for packing our components, such as:
”
”
”
”
carton
cardboard
adhesive tape made of paper
polystyrene
Tape for lead-free WIMA capacitors
We almost completely refrain from using
packing materials such as:
”
foamed polystyrene (Styropor®)
”
adhesive tapes made of plastic
”
metal clips
DIN EN ISO 14001:2005
WIMA’s environmental management has
been established in accordance with the
guidelines of DIN EN ISO 14001:2005.
The certification has been granted in
June 2006.
16
09.06
D
Typical Dimensions for
Taping Configuration
Vh
P
2
P
H
1
H
W
2
P
1
Diagram 1:
PCM 2.5/5/7.5mm
W
0
D
0
F
P
0
P
d
P
W
W
1
H
1
t
P
1
P
1
H
d
F
P
0
P
2
P
2
F
d
P
0
Diagram 2: PCM 10/15 mm
Diagram 3: PCM 22.5 and 27.5*mm
*PCM 27.5 taping possible with two feed holes between components
Dimensions for Radial Taping
Designation
Carrier tape width
Hold-down tape width
Hole position
Hold-down tape position
Feed hole diameter
Pitch of component
Feed hole pitch
Feed hole centre
to lead
Hole centre to
component centre
Feed hole centre to bottom
edge of the component
Feed hole centre to top
edge of the component
Lead spacing at
upper edge of carrier tape
Lead diameter
Component alignment
Total tape thickness
Package
(see also page 105)
Unit
v
„
Symbol
PCM 2.5 taping
W
W
0
W
1
W
2
D
0
P
P
0
P
1
P
2
H
v
H
1
F
d
Dh
t
v
PCM 5 taping
18.0
p0.5
6.0
for hot-sealing
adhesive tape
PCM 7.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 10 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 15 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 22.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 27.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
18.0
p0.5
6.0
for hot-sealing
adhesive tape
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
38.1
p1.5
12.7
p0.3
7.8
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
30.0 to 43.0
22.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
54
p2
B 60
p2
68
p2
depending
on PCM and
component dimensions
+0,08
cumulative pitch
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
*
38.1
p1.5
or 50.8
p1.5
12.7
p0.3
5.3
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
35.0 to 45.0
27.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
+0.08
cumulative pitch
error max.
1.0 mm/20 pitch
5.1
p0.5
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
2.5
p0.5
0.4
p0.05
p
2.0 max.
0.7
p0.2
3.85
p0.7
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
5.0
+0.8
–0.2
2.6
p0.7
6.35
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
24.5 to 31.5
7.5
p0.8
„
7.7
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
25.0 to 31.5
10.0
p0.8
+0.06
„
5.2
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
26.0 to 37.0
15
p0.8
+0,06
0.5
p0.05
p
2.0 max.
0.7
p0.2
ROLL/AMMO
0.5
p0.05
or
0.6
–0.05
0.5
p0.05
or
0.6
–0.05
0.8
–0.05
p
3.0 max.
0.7
p0.2
AMMO
+0,08
p
3.0 max.
0.7
p0.2
p
3.0 max.
0.7
p0.2
52
p2
B 58
p2
or
66
p2
REEL
P
360 max.
P
30
p1
B
52
p2
58
p2
depending on
comp. dimensions
REEL
P
360 max.
P
30
p1
REEL
P
500 max.
P
25
p1
see details page 107.
Dims in mm.
Please clarify customer-specific deviations with the manufacturer.
Please give „H“ dimensions and desired packaging type when ordering.
Diameter of leads see General Data.
104
09.06
*
PCM 10 and PCM 15 can be crimped to PCM 7.5.
Position of components according to PCM 7.5 (sketch 1). P
0
= 12.7 or 15.0 is possible
DSP and ARM Processors
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