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EK61
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PA78DK, PA79DK
EK61
EK61
Evaluation Kit for PA78DK & PA79DK
INTRODUCTION
Fast and easy breadboarding of circuits using the PA78DK or PA79DK is possible with the EK61 evaluation kit. The
EK61 includes both the universal EVAL36 board and the EVAL61 substrate. The use of EVAL36 and EVAL61 allows
for a large area of breadboarding space to work with while allowing a surface mount substrate for the PA78DK or
PA79DK. The PA78DK or PA79DK amplifier may be surface mounted directly to the EVAL61, a thermally conduc-
tive but electrically isolated substrate. The PA78DK or PA79DK is soldered to a DUT foil footprint area the size of
the heatslug as shown in Figure 1. The metal substrate is cost effective and can allow the PA78DK or PA79DK to
dissipate power up to the datasheet rating.
Part Number
C1206X103K631RT
C1210N4R7C501N
C1206N330J501RT
R1206000ZRT
R1206302JRT
EVAL61
EVAL36
TSM-116-01-T-SV
SSW-116-01-T-S
PA79DK
*031606
Alternate P/N
ECJ-3FB2J103K
SQCB7M4R7CAJME
12067A330JAT2A
ERJ-8GEYJR00V
ERJ-8GEYJ302V
Designator/Reference
C1,C5,C9,C10
C3,C4,C6,C7
C2,C8
J2 (GND)
R1,R2,R3.R4
Evaluation substrate
Universal PC Board
Terminal Strip, 16 PIN
Socket Strip, 16 PIN
DUT
5V, 10mA, 3.4°C/W
heatsink with fan, AAVID
Quantity
4
4
2
1
4
1
1
2
2
1
1
* Parts are not supplied. Parts are application dependant. Suggested part numbers are provided.
Figure 1 - PCB
EK61U
www.cirrus.com
Copyright © Cirrus Logic, Inc. 2010
(All Rights Reserved)
JUN 2010
1
APEX - EK61UREVF
EK61
BEFORE YOU GET STARTED
Product Innovation From
• All Apex Precision Power
TM
amplifiers should be handled using ESD precaution.
• Review the Apex Precision Power
TM
product datasheet and operating conditions.
• Always provide the appropriate heat sinking. Power dissipation must be considered to ensure maximum junction
temperature (T
J
) is not exceeded.
• Always use adequate power supply bypass capacitors, Apex Precision Power
TM
recommends at least 10µF per
amp of output current.
• Do not change connections while the circuit is powered
• In case -Vs is disconnected before +Vs, a diode between -Vs and ground is recommended to avoid damage.
• Initially set all power supplies to the minimum operating levels allowed in the product datasheet.
• Check for oscillations up to and above the unity gain bandwidth of the amplifier.
ASSEMBLY
The PA78DK & PA79DK are surface mount device and should be assembled to the EVAL61 substrate using surface
mount processes. Solder paste may be dispensed or screen-printed on the DUT pads. The heat slug on the back
of the PA78DK & PA79DK provides maximum heat dissipation capabilities when soldered to the foil footprint area.
The PA78DK & PA79DK should be reflowed to the substrate using a solder reflow furnace. If this is not available, a
heat plate capable of solder reflow temperatures may be used.
In accordance with the PA78DK and PA79DK datasheets, the package tab must be connected to a stable voltage
reference in order to achieve high slew rates. Jumpers J1 and J2 allow convenient connection of the tab to -Vs or
GND, respectively. Connect only one jumper to avoid a short circuit of the power supply.
Once the amplifier is mounted on the top of the substrate, the heat sink fan or selected heat sink can then be
mounted to the back of the substrate. A heat sink is not supplied with the kit, but several options are available
through AAVID Thermal Product, Inc. High thermal conductive thermal grease should be used when mounting the
heat sink fan or heat sink to the evaluation board.
Review Figure 3 on next page for other possible assembly methods to construct this evaluation kit.
NOTE: All grounds must be tied together on the EVAL36 board.
Figure 2 - Schematic
2
EK61U
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