ASM25DRTN datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> ASM25DRTN

ASM25DRTN: Descriptionconn edgecard 50pos dip .156 sld; CategoryThe connector; File Size467KB，2 Pages; ManufacturerSullins Connector Solutions; Environmental Compliance

Download Datasheet Parametric View All

ASM25DRTN Overview

conn edgecard 50pos dip .156 sld

ASM25DRTN Parametric

Parameter Name	Attribute value
Datasheets
Edgecard .156 in Data Shee
Standard Package	1
Category	Connectors, Interconnects
Family	Card Edge Connectors - Edgeboard Connectors
Packaging	Tray
Card Type	Non Specified - Dual Edge
Gende	Female
Number of Positions/Bay/Row	25
Number of Positions	50
Card Thickness	0.062" (1.57mm)
Number of Rows	2
Pitch	0.156" (3.96mm)
Features	-
Mounting Type	Through Hole
Terminati	Solde
Contact Material	Beryllium Coppe
Contact Finish	Gold
Contact Finish Thickness	10µin (0.25µm)
Contact Type	Full Bellows
Col	Gree
Flange Feature	-
Material - Insulati	Polyphenylene Sulfide (PPS)
Operating Temperature	-65°C ~ 150°C
Read Ou	Dual

Preview

Download Datasheet

View All

Female Card Edge

.156” [3.96 mm] Contact Centers, .431” [10.95 mm] Insulator Height,

Dip Solder/Eyelet/Right Angle

SPECIFICATIONS

• Accommodates .062” ± .008” [1.57 mm ± 0.20 mm] PC board

• Molded-in key available

• 3 Amps current rating for one contact energized

(for 5 Amps application, consult factory)

• 30 milli Ohms maximum at rated current

• UL Flammability Rating: 94V-0

READOUT

FULL BELLOWS

BACK-UP

SPRINGS

POLARIZING KEY

PLA-K1

KEY IN BETWEEN CONTACTS

(ORDER SEPARATELY)

.230”

[5.84]

.030”

[0.76]

PLM-K2

KEY IN CONTACT

(ORDER SEPARATELY)

.235”

[5.97]

.093”

[2.36]

Female Card Edge

DUAL (D)

NUMBER

SIDE

HALF LOADED (H)

.200”

[5.08]

.260”

[6.60]

CONSULT FACTORY FOR MOLDED-IN KEY

TERMINATION TYPE

.137” [3.48] (RT)

.225” [5.71] (RK)

.425” [10.80] (RY)

EYELET ACCEPTS

3-#22 AWG

.137” [3.48] (RX)

.200” [5.08] (RF)

.225” [5.71] (RU)

.408” [10.40] (RP)

(RA) .125” [3.18] FOR ALL POSITIONS

(SA) .270” [6.85] 02 THRU 25 POSITIONS

(SA) .230” [5.84] 28 THRU 36 POSITIONS

(SA) .190” [4.82]

43 POSITIONS

TOLERANCE: (RA) ± .025” [0.64]

(SA) ± .040” [1.00]

.200” [5.08]

WIDE DIP SOLDER

(RF, RX, RU, RP)

.110” ± .025” [2.79±0.64] (SX)

.210” ± .025” [5.33±0.64] (SU)

.185” [4.70]

.050” [1.27]

.156” [3.96]

FITS Ø .051” [1.30]

.140” [3.56]

ALTERNATE

EYELET SHAPE

* (RE) .014” [0.36] THICK

NARROW DIP SOLDER

(RT, RK, RY)

.225”

[5.72]

(SE) .007” [0.18] THICK

(RE) .014” [0.36] THICK

.122” [3.10] (RT)

.210” [5.33] (RK)

EYELET

.410” [10.41] (RY)

(SE OR RE)

.210” [5.33] (SE)

LETTER

SIDE

FITS Ø.051” [1.30]

RIGHT ANGLE,

DIP SOLDER

(RA, SA)

ACCEPTS .062” [1.57] PCB

CARD EXTENDER

(RT,RK,RY,SE TERMINATIONS ONLY)

REQUIRES -S13 MODIFICATION CODE

FITS Ø .051” [1.30]

MINIMUM

CENTERED DIP SOLDER

(SX, SU)

AVAILABLE WITH DUAL OR

HALF LOADED READOUT TYPE

MOUNTING STYLE

Ø.125”

[3.18]

#4-40

CLEARANCE FOR

#4 SCREW

Ø.116” [2.95],

Ø.125” [3.18]

.135” [3.43]

CLEARANCE HOLE

(H)

THREADED

INSERT

(I)

FLOATING

BOBBIN (F)

NO MOUNTING EARS

(N)

SIDE MOUNTING

(S)

* Beryllium Copper & Beryllium Nickel (H, A, J, F, C & W Material Codes) Only.

www.sullinscorp.com

760-744-0125

toll-free 888-774-3100

fax 760-744-6081

info@sullinscorp.com

Recommended Resources

Use 1 PS3001 light control switch

Dynamically biased high-fidelity power amplifier circuit (b)

LA4500 power amplifier circuit

Triangular wave-rectangular wave oscillator

Automatic water spray control circuit using infrared sensor BISS0001

Computer motherboard circuit diagram 440BX_01

Does the program need different settings when running on AT89S8253, AT89S52, or AT89C55WD?: In the past, I used AT89S52 and AT89C55WD microcontrollers. Now I want to change to AT89S8253 for capacity and cost considerations. I tried burning the same program to drive the motor, and found that ...; ltiqc Embedded System

[National Technology N32WB452 Review] + Bluetooth OTA Upgrade: [National Technology N32WB452 Review] + Bluetooth OTA Upgrade (Successful Edition)Preface:In the previous article, due to hardware failure, only theoretical analysis and C language analysis were done....; 小火苗 RF/Wirelessly

There is an error in STVD. Can you please help me find out where the error is?: I am a beginner of STVD software. Today I watched various tutorials on how to use STVD. I tried it this morning and got this error. What happened?...; chaijianvshen stm32/stm8

The information of nec chip 78f1203 was hard to find (free): [i=s]This post was last edited by paulhyde on 2014-9-15 09:14[/i] It is said that the nec chip is needed in the competition. I found it on the Internet with great difficulty. I share it with you...; 五月的咸鱼 Electronics Design Contest

Operational amplifier module data collection: Some op amp data compiled by myself...; zl6315317 MCU

The overall price of ST91X is going to increase, and the cost performance is getting lower and lower: The overall price of ST91X is going to increase, and the cost performance is getting lower and lower...; 大漠之洲 stm32/stm8

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components