Metal Oxide Power Resistors
FEATURES
•
•
•
•
•
•
Temperature Range: -55°C ~ +235°C (derated over 70°C)
±5% tolerance
Excellent flame retardant coating
Stable performance in diverse environments
High purity ceramic core
Other values may be available on request
MO Series
DERATING CURVE
-55C
100
Percent Rated Loaded
80
60
40
20
155C
0
-50
0 50 60 80
100 120 140 160 180 200 220 240
70C
Ambient Temperature (C)
PART NUMBERING SYSTEM
2
8
Series
1
-
1
0
Value
K
/
R
E
E
L
Suffix Code:
(blank)
REEL
Package:
Bulk
Tape and Reel
Suffix
SERIES, SIZE, WATTAGE, RANGE OF VALUES, VOLTAGE, AND DIMENSIONS
d
H
Series
281
282
283
286
261
262
Case Size
Small
Small
Small
Small
Standard
Standard
Watts
(W)
1
2
3
5
1
2
Standard
Range of Values
0.1 ~ 1.0M
0.1 ~ 1.0M
0.1 ~ 1.0M
0.22 ~ 560K
0.1 ~ 1.0M
0.1 ~ 1.0M
L
H
D
Dimensions (mm)
D (max.)
H ±3
4
28
5
28
5.5
28
8
5
5.5
28
28
28
Voltage (V) (max.) @ 70°C
Working
Overload Withstanding
350
600
350
350
600
350
350
600
350
500
350
350
800
600
600
500
350
350
L (max.)
10
12
16
25
12
16
d +.02, -.05
0.7
0.7
0.8
0.8
0.7
0.8
STANDARD STOCKED VALUES (Ω)
0.47
0.5
0.51
0.56
0.62
0.68
0.75
0.82
0.91
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1.0K
1.1K
1.2K
1.3K
1.5K
1.6K
1.8K
2.0K
2.2K
2.4K
2.7K
3.0K
3.3K
3.6K
3.9K
4.3K
4.7K
5.1K
5.6K
6.2K
6.8K
7.5K
8.2K
9.1K
10K
11K
12K
13K
15K
16K
18K
20K
22K
24K
27K
30K
33K
36K
39K
43K
47K
51K
56K
62K
68K
75K
82K
91K
150K 300K 560K
160K 330K 620K
180K 360K 680K
100K 200K 390K 750K
110K 220K 430K 820K
120K 240K 470K 910K
130K 270K 510K 1.0M
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600043
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
Metal Oxide Power Resistors
CONSTRUCTION
MO Series
No.
1
2
3
4
5
6
7
Name
Basic
Resistance Film
End Cap
Lead Wire
Joint
Coating
Color Code
Material
BodyRod Type Ceramics
Metal Oxide Film
Steel (Tin plated iron surface)
Annealed copper wire
(Electrosolder plated surface) Pb Free
By welding
Insulated & Non-Flame Paint (Color : Sea-Blue )
Non-Flame epoxy resin
6
2 3
4
1
5
CHARACTERISTICS
Characteristics
DC. Resistance
Limits
Must be within the specified
tolerance.
Test Methods
( JIS C 5201-1 )
5.1 The limit of error of measuring apparatus
shall not exceed allowable range or 5% of
resistance tolerance
5.2 Natural resistance change per temp.
degree centigrade.
R
2
-R
1
x10
6
(PPM/°C)
R
1
(t
2
-t
1
)
R
1
: Resistance value at room temperature (t
1
)
R
2
: Resistance value at room temp.plus 100°C (t
2
)
5.5 Permanent resistance change after the
application of a potential of 2.5 times RCWV
or the max overload voltage respectively specified
in the above list, whichever less for 5 seconds.
5.7 Resistors shall be clamped in the trough
of a 90° metallic V-block and shall be tested
at AC potential respectively specified in the
table 1 for 60 + 10/-0 seconds.
5.8 Resistance change afther 10,000 cycles
(1 second “on”, 25 seconds “off”) at 4 times
RCWV or the max. pulse overload voltage
6.1
Direct load
Resistance to a 2.5 kgs direct load for 10 secs.
in the direction of the longitudinal axis of the terminal leads.
Twist test :
Terminal leads shall be bent through 90° at a point of about
6mm from the body of the resistor and shall be rotated through 360°
about the original axis of the bent terminal in alternating direction
for a total of 3 rotations.
6.4 Permanent resistance change when leads
immersed to 3.2 to 4.8 mm from the body in
350 °C ± 10°C solder for 3 ± 0.5 seconds
6.5 The area covered with a new , smooth
clean , shiny and continuous surface free
from concentrated pinholes.
Test temp. of solder : 245°C ± 3°C
Dwell time in solder : 2 ~ 3 seconds
Temperature
coefficient
Within the temperature
coefficient specified below
±350 PPM / °C
Short time
overload
Resistance change rate is
± (2 % + 0.05Ω) Max. with no
evidence of mechanical damage
Dielectric
withstanding
voltage
No evidence of flashover
mechanical damage,arcing or
insulation break down.
Pulse overload
Resistance change rate is
±(5% +0.05Ω) Max. with no
evidence of mechanical damage
Terminal
strength
With no evidence of mechanical
damage.
Resistance to
soldering heat
Resistance change rate is
± (1% + 0.05Ω) Max. with no
evidence of mechanical damage.
Solderability
95 % coverage Min.
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600043
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
Metal Oxide Power Resistors
CHARACTERISTICS
(Cont.)
Characteristics
Resistance to
solvent
Limits
No deterioration of protective
coatings and markings.
Test Methods
( JIS C 5201-1 )
MO Series
6.9 Specimens shall be immersed in a bath of
trichroethane completely for 3 minutes with
ultrasonic.
7.4 Resistance change after continuous
5 cycles for duty shown below:
StepTemperature
Time
1
-55°C ±3°C
2
Room temp.
3
+155°C ±2°C
4
Room temp.
7.9 Resistance change after 1,000 hours
operating at RCWV with duty cycle of
(1.5 hours "on", 0.5 hour "off") in a humidity
test chamber controlled at 40°C ± 2°C
and 90 to 95 % relative humidity
7.10 Permanent resistance change after
1,000 hours operating at RCWV with duty
cycle of ( 1.5 hours "on", 0.5 hour "off" ) at
70°C ± 2°C ambient
7.12 Resistors shall resist flaming or arcing
when overloaded up to 16 times RCWV
Temperature
cycling
Resistance change rate is
± (2% + 0.05Ω) Max. with no
evidence of mechanical damage.
30 mins
10~15 mins
30 mins
10~15 mins
Resistance value
Load life in
humidity
< than 100KΩ
>100KΩ
∆R/R
±5%
± 10 %
Resistance value
Load life
< than 100KΩ
> 100KΩ
Non-Flame
∆R/R
±5%
± 10 %
No evidence of flaming or arcing
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600043
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
NXP MCU
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