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A42MX36-BGG272I

Description
fpga - field programmable gate array 54k system gates
CategoryProgrammable logic devices    Programmable logic   
File Size3MB,124 Pages
ManufacturerActel
Websitehttp://www.actel.com/
Environmental Compliance
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A42MX36-BGG272I Overview

fpga - field programmable gate array 54k system gates

A42MX36-BGG272I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerActel
package instructionPLASTIC, BGA-272
Reach Compliance Codecompli
Other featuresALSO OPERATE AT 5.0V SUPPLY
Combined latency of CLB-Max2.7 ns
JESD-30 codeS-PBGA-B272
JESD-609 codee1
length27 mm
Humidity sensitivity level3
Configurable number of logic blocks1184
Equivalent number of gates54000
Number of entries202
Number of logical units2438
Output times202
Number of terminals272
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1184 CLBS, 54000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA272,20X20,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)250
power supply3.3,3.3/5,5 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height2.5 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width27 mm
v6.1
40MX and 42MX FPGA Families
Features
High Capacity
Single-Chip ASIC Alternative
3,000 to 54,000 System Gates
Up to 2.5 kbits Configurable Dual-Port SRAM
Fast Wide-Decode Circuitry
Up to 202 User-Programmable I/O Pins
HiRel Features
Commercial, Industrial, Automotive, and Military
Temperature Plastic Packages
Commercial, Military Temperature, and MIL-STD-883
Ceramic Packages
QML Certification
Ceramic Devices Available to DSCC SMD
Ease of Integration
Mixed-Voltage Operation (5.0V or 3.3V for core and
I/Os), with PCI-Compliant I/Os
Up to 100% Resource Utilization and 100% Pin
Locking
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Verification
Capability with Silicon Explorer II
Low Power Consumption
IEEE Standard 1149.1 (JTAG) Boundary Scan Testing
High Performance
5.6 ns Clock-to-Out
250 MHz Performance
5 ns Dual-Port SRAM Access
100 MHz FIFOs
7.5 ns 35-Bit Address Decode
Product Profile
Device
Capacity
System Gates
SRAM Bits
Logic Modules
Sequential
Combinatorial
Decode
Clock-to-Out
SRAM Modules
(64x4 or 32x8)
Dedicated Flip-Flops
Maximum Flip-Flops
Clocks
User I/O (maximum)
PCI
Boundary Scan Test (BST)
Packages (by pin count)
PLCC
PQFP
VQFP
TQFP
CQFP
PBGA
A40MX02
3,000
295
9.5 ns
147
1
57
44, 68
100
80
A40MX04
6,000
547
9.5 ns
273
1
69
44, 68, 84
100
80
A42MX09
14,000
348
336
5.6 ns
348
516
2
104
84
100, 160
100
176
A42MX16
24,000
624
608
6.1 ns
624
928
2
140
84
100, 160, 208
100
176
A42MX24
36,000
954
912
24
6.1 ns
954
1,410
2
176
Yes
Yes
84
160, 208
176
A42MX36
54,000
2,560
1,230
1,184
24
6.3 ns
10
1,230
1,822
6
202
Yes
Yes
208, 240
208, 256
272
April 2009
© 2009 Actel Corporation
i
See the Actel website for the latest version of the datasheet.
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