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A3PE600-2FGG484I

Description
fpga - field programmable gate array 600k system gates
CategoryProgrammable logic devices    Programmable logic   
File Size5MB,158 Pages
ManufacturerActel
Websitehttp://www.actel.com/
Environmental Compliance
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A3PE600-2FGG484I Overview

fpga - field programmable gate array 600k system gates

A3PE600-2FGG484I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerActel
package instruction23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Reach Compliance Codecompliant
maximum clock frequency350 MHz
JESD-30 codeS-PBGA-B484
JESD-609 codee1
length23 mm
Humidity sensitivity level3
Configurable number of logic blocks13824
Equivalent number of gates600000
Number of entries270
Number of logical units13824
Output times270
Number of terminals484
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize13824 CLBS, 600000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA484,22X22,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)250
power supply1.5/3.3 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height2.44 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.425 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width23 mm
Revision 9
ProASIC3E Flash Family FPGAs
with Optional Soft ARM
®
Support
Features and Benefits
High Capacity
• 600 k to 3 Million System Gates
• 108 to 504 kbits of True Dual-Port SRAM
• Up to 620 User I/Os
®
Pro (Professional) I/O
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—up to 8 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS
2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the ProASIC
®
3E Family
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Live at Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
On-Chip User Nonvolatile Memory
• 1 kbit of FlashROM with Synchronous Interfacing
High Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock
®
to Secure FPGA Contents
Clock Conditioning Circuit (CCC) and PLL
• Six CCC Blocks, Each with an Integrated PLL
• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
and External Feedback
• Wide Input Frequency Range (1.5 MHz to 200 MHz)
Low Power
• Core Voltage for Low Power
• Support for 1.5-V-Only Systems
• Low-Impedance Flash Switches
SRAMs and FIFOs
• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
• True Dual-Port SRAM (except ×18)
• 24 SRAM and FIFO Configurations with Synchronous Operation
up to 350 MHz
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
ARM Processor Support in ProASIC3E FPGAs
• M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available
with or without Debug
Table 1-1 • ProASIC3E Product Family
ProASIC3E Devices
Cortex-M1 Devices
System Gates
VersaTiles (D-flip-flops)
RAM Kbits (1,024 bits)
4,608-Bit Blocks
FlashROM Kbits
Secure (AES) ISP
CCCs with Integrated PLLs
VersaNet Globals
3
I/O Banks
Maximum User I/Os
Package Pins
PQFP
FBGA
2
1
A3PE600
600,000
13,824
108
24
1
Yes
6
18
8
270
PQ208
FG256, FG484
A3PE1500
M1A3PE1500
1,500,000
38,400
270
60
1
Yes
6
18
8
444
PQ208
FG484, FG676
A3PE3000
M1A3PE3000
3,000,000
75,264
504
112
1
Yes
6
18
8
620
PQ208
FG324
,
FG484, FG896
Notes:
1. Refer to the
Cortex-M1
product brief for more information.
2. The PQ208 package supports six CCCs and two PLLs.
3. Six chip (main) and three quadrant global networks are available.
4. For devices supporting lower densities, refer to the
ProASIC3 Flash Family FPGAs
datasheet.
August 2009
© 2010 Actel Corporation
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