M1A3PE1500-FGG676I datasheet, PDF

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M1A3PE1500-FGG676I: Descriptionfpga - field programmable gate array 1.5M system gates proasic; CategoryProgrammable logic devices Programmable logic; File Size5MB，158 Pages; ManufacturerActel; Websitehttp://www.actel.com/; Environmental Compliance

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M1A3PE1500-FGG676I Overview

fpga - field programmable gate array 1.5M system gates proasic

M1A3PE1500-FGG676I Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Actel
package instruction	27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676
Reach Compliance Code	compliant
maximum clock frequency	350 MHz
JESD-30 code	S-PBGA-B676
JESD-609 code	e1
length	27 mm
Humidity sensitivity level	3
Configurable number of logic blocks	38400
Equivalent number of gates	1500000
Number of entries	444
Number of logical units	38400
Output times	444
Number of terminals	676
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	38400 CLBS, 1500000 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA676,26X26,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	250
power supply	1.5/3.3 V
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	2.44 mm
Maximum supply voltage	1.575 V
Minimum supply voltage	1.425 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	27 mm

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Revision 9

ProASIC3E Flash Family FPGAs

with Optional Soft ARM

Support

Features and Benefits

High Capacity

• 600 k to 3 Million System Gates

• 108 to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Pro (Professional) I/O

•

700 Mbps DDR, LVDS-Capable I/Os

1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

Bank-Selectable I/O Voltages—up to 8 Banks per Chip

Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS

2.5 V / 5.0 V Input

Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS

Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3

Class I and II

I/O Registers on Input, Output, and Enable Paths

Hot-Swappable and Cold Sparing I/Os

Programmable Output Slew Rate and Drive Strength

Programmable Input Delay

Schmitt Trigger Option on Single-Ended Inputs

Weak Pull-Up/-Down

IEEE 1149.1 (JTAG) Boundary Scan Test

Pin-Compatible Packages across the ProASIC

3E Family

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Live at Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

On-Chip User Nonvolatile Memory

• 1 kbit of FlashROM with Synchronous Interfacing

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock

to Secure FPGA Contents

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks, Each with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities

and External Feedback

• Wide Input Frequency Range (1.5 MHz to 200 MHz)

Low Power

• Core Voltage for Low Power

• Support for 1.5-V-Only Systems

• Low-Impedance Flash Switches

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,

and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• 24 SRAM and FIFO Configurations with Synchronous Operation

up to 350 MHz

High-Performance Routing Hierarchy

•

Segmented, Hierarchical Routing and Clock Structure

Ultra-Fast Local and Long-Line Network

Enhanced High-Speed, Very-Long-Line Network

High-Performance, Low-Skew Global Network

Architecture Supports Ultra-High Utilization

ARM Processor Support in ProASIC3E FPGAs

• M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available

with or without Debug

Table 1-1 • ProASIC3E Product Family

ProASIC3E Devices

Cortex-M1 Devices

System Gates

VersaTiles (D-flip-flops)

RAM Kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Kbits

Secure (AES) ISP

CCCs with Integrated PLLs

VersaNet Globals

I/O Banks

Maximum User I/Os

Package Pins

PQFP

FBGA

A3PE600

600,000

13,824

108

Yes

270

PQ208

FG256, FG484

A3PE1500

M1A3PE1500

1,500,000

38,400

270

Yes

444

PQ208

FG484, FG676

A3PE3000

M1A3PE3000

3,000,000

75,264

504

112

Yes

620

PQ208

FG324

FG484, FG896

Notes:

1. Refer to the

Cortex-M1

product brief for more information.

2. The PQ208 package supports six CCCs and two PLLs.

3. Six chip (main) and three quadrant global networks are available.

4. For devices supporting lower densities, refer to the

ProASIC3 Flash Family FPGAs

datasheet.

August 2009

ProASIC3E Flash Family FPGAs

Table of Contents

ProASIC3E Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3E DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-64

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-68

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-71

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-72

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-84

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-84

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-85

Package Pin Assignments

208-Pin PQFP

256-Pin FBGA

324-Pin FBGA

484-Pin FBGA

676-Pin FBGA

896-Pin FBGA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-40

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8

Revision 9

Recommended Resources

Dynamic scanning spectrum display

temperature control

Constant voltage source using operational amplifier TAA861

Modular anti-theft system

Wireless remote control/touch switch circuit

Thermocouple AD conversion circuit

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