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44-6553-11*

Description
IC and device socket dip test sckt gold 44 pins
CategoryThe connector   
File Size437KB,1 Pages
ManufacturerAries Electronics
Environmental Compliance
Download Datasheet Parametric View All

44-6553-11* Overview

IC and device socket dip test sckt gold 44 pins

44-6553-11* Parametric

Parameter NameAttribute value
MakerAries Electronics
Product CategoryIC and device sockets
RoHSyes
productZero Insertion Force (ZIF) Sockets
Number of locations/contacts44
Contact platingGold Over Nickel
Installation stylePCB
Series X55X Universal Zero-Insertion-Force
DIP Test Socket
FEATURES
• Aries Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] cen-
ters.
• All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers.
• Contacts are normally closed to eliminate dependence on plastic to sustain contact.
• Socket handle can be configured with closed contacts (on) when in the UP or DOWN
position, and can be mounted on either the right or left side.
• Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries’
or any competitive test socket receptacle.
GENERAL SPECIFICATIONS
• SOCKET BODY: black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS)
CUSTOMIZATION:
In addition to the standard products shown
• HANDLE: Stainless Steel
on this page, Aries specializes in custom design and production.
• HANDLE KNOB: Brass 360, 1/2-hard
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity.
NOTE:
Aries reserves the
• CONTACTS: BeCu 172 per QQ-C-533
or
BeNi 360 1/2-hard
• CONTACT PLATING: 50μ [1.27μ] min. Ni under-plate per QQ-N-290, over-plated
right to change product general specifications without notice.
with either 200μ [5.08μ] min. matte Sn per ASTM
ORDERING INFORMATION
B545-97 or 200μ [5.08μ] 90/10 Sn/Pb per MIL-
XX-X55X-1 X
T-10727 or 10μ [0.254μ] min. Au per MIL-G-45204
• BeNi CONTACT PLATING: 50μ [1.27μ] min. NiB
Pins
Plating
• CONTACT CURRENT RATING: 1 amp
24, 28, 32, 36,
0 = Sn over Ni
• INSULATION RESISTANCE: 1000 mΩ min.
40, 42, 44, 48
0TL = Sn/Pb over Ni
• DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC
Row-to-Row Spacing
(btm)
1 = Au over Ni
• LIFE CYCLE: 25,000 to 50,000 cycles
3 = 0.300 [7.62]
6 = NiB BeNi Contact Only
• OPERATING TEMPERATURE: -67°F [-55°C] min.;
6 = 0.600 [15.24]
Solder Pin Tail
221°F [105°C] max. for Sn plating; 302°F [150°C]
Handle Options
for Au plating; 392°F [200°C] for NiB plating
1 = Left, up is on
• RETENTION FORCE (closed): 55g/pin based on a
2 = Right, up is on
0.020 [0.51] dia. test lead
3 = Left, down is on
• ACCEPTS LEADS: 0.015-0.045 [0.38-1.14] wide,
4 = Right, down is on (std)
0.110-0.280 [2.79-7.11] long
NOTE: “on” = closed contacts
MOUNTING CONSIDERATIONS
• See Socket Footprint below
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
“A” = (NO. OF PINS PER ROW x 0.100 [2.54]) + 0.590 [14.99]
“B” = (NO. OF PINS PER ROW -1) x 0.100 [2.54]
“C” = (NO. OF PINS PER ROW x 0.100 [2.54] + 0.415 [10.54]
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
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