74LVT16244BEV-S datasheet, PDF

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74LVT16244BEV-S: DescriptionBuffer and Line Driver 3.3V buf/LN drvr N-inv 3S; Categorylogic logic; File Size169KB，18 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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74LVT16244BEV-S Overview

Buffer and Line Driver 3.3V buf/LN drvr N-inv 3S

74LVT16244BEV-S Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	FBGA, BGA56,6X10,25
Reach Compliance Code	unknow
Control type	ENABLE LOW
JESD-30 code	R-PBGA-B56
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.064 A
Number of digits	4
Number of functions	4
Number of terminals	56
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA56,6X10,25
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
power supply	3.3 V
Prop。Delay @ Nom-Su	3.2 ns
Certification status	Not Qualified
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	BICMOS
Temperature level	AUTOMOTIVE
Terminal form	BALL
Terminal pitch	0.635 mm
Terminal location	BOTTOM
Base Number Matches	1

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74LVT16244B; 74LVTH16244B

3.3 V 16-bit buffer/driver; 3-state

Rev. 08 — 22 March 2010

Product data sheet

1. General description

The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for

operation at 3.3 V.

This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.

The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.

2. Features and benefits

16-bit bus interface

3-state buffers

Output capability: +64 mA and

−32

TTL input and output switching levels

Input and output interface capability to systems at 5 V supply

Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs

Power-up 3-state

Live insertion and extraction permitted

No bus current loading when output is tied to 5 V bus

Latch-up protection

JESD78B Class II exceeds 500 mA

ESD protection:

HBM JESD22-A114F exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74LVT16244BDL

74LVTH16244BDL

74LVT16244BDGG

74LVTH16244BDGG

74LVT16244BEV

74LVT16244BBQ

74LVTH16244BBQ

−40 °C

to +85

°C

−40 °C

to +85

°C

VFBGA56

−40 °C

to +85

°C

TSSOP48

−40 °C

to +85

°C

Name

SSOP48

Description

plastic shrink small outline package; 48 leads;

body width 7.5 mm

plastic thin shrink small outline package;

48 leads; body width 6.1 mm

plastic very thin fine-pitch ball grid array

package; 56 balls; body 4.5

0.65 mm

Version

SOT370-1

SOT362-1

SOT702-1

SOT1134-1

Type number

HXQFN60U plastic thermal enhanced extremely thin quad

flat package; no leads; 60 terminals; UTLP

based; body 4

0.5 mm

74LVT16244BEV-S Related Products

	74LVT16244BEV-S	74LVTH16244BDL-T	74LVTH16244BBQ,518	74LVT16244BBQ,518
Description	Buffer and Line Driver 3.3V buf/LN drvr N-inv 3S	Buffer and line driver 3.3V buf/ldrvr non-inv 3S	IC BUF NON-INVERT 3.6V 60HUQFN	IC BUF NON-INVERT 3.6V 60HUQFN
Is it Rohs certified?	incompatible	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP
package instruction	FBGA, BGA56,6X10,25	SSOP, SSOP48,.4	LGA, LGA60,8X12,20	LGA, LGA60,8X12,20
Reach Compliance Code	unknow	unknown	compliant	compliant
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
JESD-30 code	R-PBGA-B56	R-PDSO-G48	R-PBGA-N60	R-PBGA-N60
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.064 A	0.064 A	0.064 A	0.064 A
Number of digits	4	4	4	4
Number of functions	4	4	4	4
Number of terminals	56	48	60	60
Maximum operating temperature	125 °C	125 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	SSOP	LGA	LGA
Encapsulate equivalent code	BGA56,6X10,25	SSOP48,.4	LGA60,8X12,20	LGA60,8X12,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH	SMALL OUTLINE, SHRINK PITCH	GRID ARRAY	GRID ARRAY
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	NO LEAD	NO LEAD
Terminal pitch	0.635 mm	0.635 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	DUAL	BOTTOM	BOTTOM
Base Number Matches	1	1	-	1
method of packing	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Prop。Delay @ Nom-Sup	-	3.2 ns	3.2 ns	3.2 ns

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