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74LVTH16244BDL-T

Description
Buffer and line driver 3.3V buf/ldrvr non-inv 3S
Categorylogic    logic   
File Size169KB,18 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74LVTH16244BDL-T Overview

Buffer and line driver 3.3V buf/ldrvr non-inv 3S

74LVTH16244BDL-T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
package instructionSSOP, SSOP48,.4
Reach Compliance Codeunknown
Control typeENABLE LOW
JESD-30 codeR-PDSO-G48
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.064 A
Number of digits4
Number of functions4
Number of terminals48
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP48,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
method of packingTAPE AND REEL
power supply3.3 V
Prop。Delay @ Nom-Sup3.2 ns
Certification statusNot Qualified
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyBICMOS
Temperature levelAUTOMOTIVE
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Base Number Matches1
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Rev. 08 — 22 March 2010
Product data sheet
1. General description
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for
V
CC
operation at 3.3 V.
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.
2. Features and benefits
16-bit bus interface
3-state buffers
Output capability: +64 mA and
−32
mA
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
Power-up 3-state
Live insertion and extraction permitted
No bus current loading when output is tied to 5 V bus
Latch-up protection
JESD78B Class II exceeds 500 mA
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LVT16244BDL
74LVTH16244BDL
74LVT16244BDGG
74LVTH16244BDGG
74LVT16244BEV
74LVT16244BBQ
74LVTH16244BBQ
−40 °C
to +85
°C
−40 °C
to +85
°C
VFBGA56
−40 °C
to +85
°C
TSSOP48
−40 °C
to +85
°C
Name
SSOP48
Description
plastic shrink small outline package; 48 leads;
body width 7.5 mm
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
plastic very thin fine-pitch ball grid array
package; 56 balls; body 4.5
×
7
×
0.65 mm
Version
SOT370-1
SOT362-1
SOT702-1
SOT1134-1
Type number
HXQFN60U plastic thermal enhanced extremely thin quad
flat package; no leads; 60 terminals; UTLP
based; body 4
×
6
×
0.5 mm

74LVTH16244BDL-T Related Products

74LVTH16244BDL-T 74LVT16244BEV-S 74LVTH16244BBQ,518 74LVT16244BBQ,518
Description Buffer and line driver 3.3V buf/ldrvr non-inv 3S Buffer and Line Driver 3.3V buf/LN drvr N-inv 3S IC BUF NON-INVERT 3.6V 60HUQFN IC BUF NON-INVERT 3.6V 60HUQFN
Is it Rohs certified? conform to incompatible conform to conform to
Maker NXP NXP NXP NXP
package instruction SSOP, SSOP48,.4 FBGA, BGA56,6X10,25 LGA, LGA60,8X12,20 LGA, LGA60,8X12,20
Reach Compliance Code unknown unknow compliant compliant
Control type ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
JESD-30 code R-PDSO-G48 R-PBGA-B56 R-PBGA-N60 R-PBGA-N60
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.064 A 0.064 A 0.064 A 0.064 A
Number of digits 4 4 4 4
Number of functions 4 4 4 4
Number of terminals 48 56 60 60
Maximum operating temperature 125 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP FBGA LGA LGA
Encapsulate equivalent code SSOP48,.4 BGA56,6X10,25 LGA60,8X12,20 LGA60,8X12,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH GRID ARRAY, FINE PITCH GRID ARRAY GRID ARRAY
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS
Temperature level AUTOMOTIVE AUTOMOTIVE INDUSTRIAL INDUSTRIAL
Terminal form GULL WING BALL NO LEAD NO LEAD
Terminal pitch 0.635 mm 0.635 mm 0.5 mm 0.5 mm
Terminal location DUAL BOTTOM BOTTOM BOTTOM
method of packing TAPE AND REEL - TAPE AND REEL TAPE AND REEL
Prop。Delay @ Nom-Sup 3.2 ns - 3.2 ns 3.2 ns
Base Number Matches 1 1 - 1
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