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74LV10N

Description
triple 3-input nand gate
Categorylogic    logic   
File Size107KB,10 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

74LV10N Overview

triple 3-input nand gate

74LV10N Parametric

Parameter NameAttribute value
MakerNXP
package instructionDIP,
Reach Compliance Codeunknow
seriesLV/LV-A/LVX/H
JESD-30 codeR-PDIP-T14
length19.025 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
propagation delay (tpd)44 ns
Certification statusNot Qualified
Maximum seat height4.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
INTEGRATED CIRCUITS
74LV10
Triple 3-input NAND gate
Product specification
Supersedes data of 1997 Feb 12
IC24 Data Handbook
1998 Apr 20
Philips
Semiconductors

74LV10N Related Products

74LV10N 74LV10 74LV10D 74LV10DB 74LV10PW 74LV10PWDH
Description triple 3-input nand gate triple 3-input nand gate triple 3-input nand gate triple 3-input nand gate triple 3-input nand gate triple 3-input nand gate
Maker NXP - NXP NXP NXP NXP
package instruction DIP, - SOP, SOP14,.25 SSOP, TSSOP, TSSOP,
Reach Compliance Code unknow - compli unknow unknow unknow
series LV/LV-A/LVX/H - LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 code R-PDIP-T14 - R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
length 19.025 mm - 8.65 mm 6.2 mm 5 mm 5 mm
Load capacitance (CL) 50 pF - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NAND GATE - NAND GATE NAND GATE NAND GATE NAND GATE
Number of functions 3 - 3 3 3 3
Number of entries 3 - 3 3 3 3
Number of terminals 14 - 14 14 14 14
Maximum operating temperature 125 °C - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP - SOP SSOP TSSOP TSSOP
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE - SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 44 ns - 44 ns 44 ns 44 ns 44 ns
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.2 mm - 1.75 mm 2 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1 V - 1 V 1 V 1 V 1 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO - YES YES YES YES
technology CMOS - CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form THROUGH-HOLE - GULL WING GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm - 1.27 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL - DUAL DUAL DUAL DUAL
width 7.62 mm - 3.9 mm 5.3 mm 4.4 mm 4.4 mm
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