KM531A33201400 datasheet, PDF - EEWORLD Datasheet

KM531A33201400: DescriptionCAPACITOR, METALLIZED FILM, POLYCARBONATE, 400V, 0.00332uF, THROUGH HOLE MOUNT, RADIAL LEADED; CategoryPassive components capacitor; File Size127KB，1 Pages; ManufacturerEurofarad

Download Datasheet Parametric View All

KM531A33201400 Overview

CAPACITOR, METALLIZED FILM, POLYCARBONATE, 400V, 0.00332uF, THROUGH HOLE MOUNT, RADIAL LEADED

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1987601230
package instruction	,
Reach Compliance Code	compliant
ECCN code	EAR99
YTEOL	5.7
capacitance	0.00332 µF
Capacitor type	FILM CAPACITOR
dielectric materials	POLYCARBONATE
Installation features	THROUGH HOLE MOUNT
negative tolerance	1%
Number of terminals	2
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package shape	RECTANGULAR PACKAGE
positive tolerance	1%
Rated (DC) voltage (URdc)	400 V
surface mount	NO
Terminal shape	WIRE

CCSv4.0.2, 32k limited version: After installing CCSv4.0.2, 32k limited version, it said that this version does not have its own XDSv2 driver. Then it gave the update method, but when I entered http://software-dl.ti.com/dsps/dsps_pu...; l0700830216 Microcontroller MCU

The simplest single-chip control solution for ultrasonic ranging of reversing radar: :victory: The simplest single-chip control solution for ultrasonic ranging of reversing radar[size=8pt][url=http://www.fosvos.com/gm3101/gm3101.pdf][size=8pt][size=5][color=#810081]GM3101[/color][/siz...; ENGFOSVOS Automotive Electronics

About the serial port debugging problem of Launchpad: Recently, I also wanted to debug the serial port on Launchpad. Like everyone else, I also downloaded the example program from TI's official website. I saw a great person in the forum saying that there...; 我很无语啊 Microcontroller MCU

[ISSCC] UCLA's new software-defined wireless RF chip combines broadband circuits with discrete-time processing: UCLA (University of California, Los Angeles) and WiLinx Corporation of the United States announced a broadband receiving IC for software wireless devices at the "ISSCC 2006" conference held recently. ...; fighting RF/Wirelessly

Active-Semi holds "Day One" event and officially joins the Qorvo family: [color=rgb(89, 89, 89)][font=微软雅黑, "][size=14px]Recently, Qorvo and its recently acquired company Active-Semi held a grand "Day One" event. As a reserved program for Qorvo's acquisitions, Active-Semi'...; alan000345 RF/Wirelessly

Shenzhen Electronic Hardware Engineer: Job Responsibilities:1. Select materials and components according to product system solutions;2. Responsible for circuit board schematic design, PCB design, and BOM output;3. Responsible for product h...; sbim Recruitment

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components