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W24258Q-70LI

Description
32k X 8 cmos static ram
Categorystorage    storage   
File Size198KB,11 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W24258Q-70LI Overview

32k X 8 cmos static ram

W24258Q-70LI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeTSOP
package instruction8 X 13.40 MM, TSOP1-28
Contacts28
Reach Compliance Code_compli
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length11.8 mm
memory density262144 bi
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP28,.53,22
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000002 A
Minimum standby current2 V
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
W24258
32K
×
8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24258 is a normal speed, very low power CMOS static RAM organized as 32768
×
8 bits that
operates on a wide voltage range from 2.7V to 5.5V power supply. The W24258 family, W24258-
70LE and W24258-70LI, can meet requirement of various operating temperature. This device is
manufactured using Winbond's high performance CMOS technology.
FEATURES
Low power consumption:
Active: 350 mW (max.)
Standby: 6
µW
(max.)/3V
25
µW
(max.)/5V
Access time: 70 nS (max.)/5V
100 nS (max.)/3V
Single 3V/5V power supply
Fully static operation
All inputs and outputs directly TTL compatible
Three-state outputs
Battery back-up operation capability
Data retention voltage: 2V (min.)
Packaged in 28-pin 600 mil DIP, 330 mil SOP
and standard type one TSOP (8 mm
×
13.4
mm)
PIN CONFIGURATIONS
BLOCK DIAGRAM
CLK GEN.
A12
A14
A2
R
O
W
D
E
C
O
D
E
R
PRECHARGE CKT.
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28-pin
DIP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
DD
WE
A13
A8
A9
A11
OE
A10
CS
I/O8
I/O7
I/O6
I/O5
I/O4
A3
A4
A5
A6
A7
A13
I/O1
I/O8
CORE CELL ARRAY
512 ROWS
64 X 8 COLUMNS
DATA
CNTRL.
CLK
GEN.
I/O CKT.
COLUMN DECODER
WE
CS
OE
A11 A10 A1 A0 A8 A9
PIN DESCRIPTION
OE
A11
A9
A8
A13
WE
V
DD
A14
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
1
0
1
1
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A10
CS
I/O8
I/O7
I/O6
I/O5
I/O4
V
SS
I/O3
I/O2
I/O1
A0
A1
A2
28-pin
TSOP
SYMBOL
A0−A14
I/O1−I/O8
CS
WE
OE
V
DD
V
SS
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Select Input
Write Enable Input
Output Enable Input
Power Supply
Ground
-1-
Publication Release Date: November 1998
Revision A8

W24258Q-70LI Related Products

W24258Q-70LI W24258-70LI W24258H W24258 W24258-70LE W24258Q-70LE W24258S-70LE W24258S-70LI
Description 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram 32k X 8 cmos static ram
Is it Rohs certified? incompatible incompatible - - incompatible incompatible incompatible incompatible
Maker Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code TSOP DIP DIE - DIP TSOP SOIC SOIC
package instruction 8 X 13.40 MM, TSOP1-28 0.600 INCH, PLASTIC, DIP-28 DIE, - 0.600 INCH, PLASTIC, DIP-28 8 X 13.40 MM, TSOP1-28 0.330 INCH, SOP-28 0.330 INCH, SOP-28
Contacts 28 28 28 - 28 28 28 28
Reach Compliance Code _compli _compli unknow - _compli _compli _compli _compli
ECCN code EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 100 ns 100 ns - 100 ns 100 ns 100 ns 100 ns
I/O type COMMON COMMON - - COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G28 R-PDIP-T28 R-XUUC-N28 - R-PDIP-T28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28
JESD-609 code e0 e0 - - e0 e0 e0 e0
length 11.8 mm 37.08 mm - - 37.08 mm 11.8 mm 18.11 mm 18.11 mm
memory density 262144 bi 262144 bi 262144 bi - 262144 bi 262144 bi 262144 bi 262144 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 - 8 8 8 8
Number of functions 1 1 1 - 1 1 1 1
Number of terminals 28 28 28 - 28 28 28 28
word count 32768 words 32768 words 32768 words - 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 - 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C - - -20 °C -20 °C -20 °C -40 °C
organize 32KX8 32KX8 32KX8 - 32KX8 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE - - 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 DIP DIE - DIP TSOP1 SOP SOP
Encapsulate equivalent code TSSOP28,.53,22 DIP28,.6 - - DIP28,.6 TSSOP28,.53,22 SOP28,.5 SOP28,.5
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE IN-LINE UNCASED CHIP - IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED 240 NOT SPECIFIED NOT SPECIFIED
power supply 3/5 V 3/5 V - - 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 5.33 mm - - 5.33 mm 1.2 mm 2.85 mm 2.85 mm
Maximum standby current 0.000002 A 0.000002 A - - - 0.000002 A 0.000002 A 0.000002 A
Minimum standby current 2 V 2 V - - 2 V 2 V 2 V 2 V
Maximum slew rate 0.07 mA 0.07 mA - - 0.07 mA 0.07 mA 0.07 mA 0.07 mA
Maximum supply voltage (Vsup) 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V - 3 V 3 V 3 V 3 V
surface mount YES NO YES - NO YES YES YES
technology CMOS CMOS CMOS - CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL - OTHER OTHER OTHER INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE NO LEAD - THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 0.55 mm 2.54 mm - - 2.54 mm 0.55 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL UPPER - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
width 8 mm 15.24 mm - - 15.24 mm 8 mm 8.41 mm 8.41 mm

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