2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS
ISM97 Series
Product Features:
Low Jitter, Non-PLL Based Output
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
Frequency
Output Level
HC-MOS
TTL
Duty Cycle
Rise / Fall Time
Output Load
Frequency Stability
Start-up Time
Enable / Disable
Time
Supply Voltage
Current
1.000 MHz to 152.250 MHz
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
Specify 50% ±10% or ±5% See Table in Part Number Guide
6 nS Max.
See Table in Part Number Guide
See Frequency Stability Table (Includes room temperature tolerance and
stability over operating temperature)
10 mS Max.
100 nS Max. N.C. or
≥
70% Vdd = Enable.
≤
30% Vdd = Disable.
See Input Voltage Table, tolerance ±5 %
25 mA Max. (5.0V)
20 mA Max. (1.8V-3.3V)
2.0
1.3
Recommended Pad layout
2.6
Operating
Storage
Jitter:
RMS(1sigma)
1 MHz-60 MHz
Max Integrated
1 MHz-60 MHz
Max Total Jitter
1 MHz-60 MHz
See Operating Temperature Table in Part Number Guide
-55
C to +125
C
1.4
5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods)
1.5 pS RMS (1 sigma -12KHz to 20MHz)
50 pS p-p (100K adjacent periods)
Pin Connection
1
Enable
2
GND
3
Output
4
Vcc
Dimension Units: mm
Part Number Guide
Package
Input
Voltage
5 = 5.0 V
3 = 3.3 V
7 = 3.0 V
2 = 2.7 V
6 = 2.5 V
1 = 1.8 V*
Sample Part Number:
Symmetry
(Duty Cycle)
5 = 45 / 55 Max.
6 = 40 / 60 Max.
ISM97
- 3251BH - 20.000
Stability
(in ppm)
**E =
10
**D =
15
**F =
20
**A =
25
B =
50
C =
100
Operating
Temperature
1 = 0 C to +70 C
6 = -10 C to +70 C
3 = -20 C to +70 C
4 = -30 C to +75 C
2 = -40 C to +85 C
Output
1 = 10TTL / 15 pF HC-MOS
6 = 30 pF
5 = 50 pF HC-MOS (<40 MHz)
Enable /
Disable
H = Enable
O = N/C
Frequency
I
SM97 -
- 20.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/12/15_C
Page 1 of 2
2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS
Pb Free Solder Reflow Profile:
ISM97 Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic; storage life is unlimited under normal room conditions.
Termination = e4 (Au over Ni over W base metalization.
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8.0 +/-.2
4.0 +/-.2
5.5 +/-.1
9.0 +/-1
50 / 60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
PROPRIETARY AND CONFIDENTIAL
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY
PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America.
ILSI America Phone 775-851-8880
●
Fax 775-851-8882
●email:
e-mail@ilsiamerica.com
●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/12/15_C
Page 2 of 2
Microcontroller MCU
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