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W83627HG

Description
winbond lpc I/O
File Size1004KB,131 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W83627HG Overview

winbond lpc I/O

W83627HF/F
W83627HG/G
Winbond LPC I/O
Date: 2006/06/09
Revision: 2.27

W83627HG Related Products

W83627HG W83627G-AW W83627HG-AW
Description winbond lpc I/O winbond lpc I/O winbond lpc I/O
Is it Rohs certified? - conform to conform to
Maker - Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code - QFP QFP
package instruction - PLASTIC, QFP-128 FQFP, QFP128,.67X.93,20
Contacts - 128 128
Reach Compliance Code - unknow compliant
Address bus width - 4 4
boundary scan - NO NO
Bus compatibility - LPC LPC
maximum clock frequency - 48 MHz 48 MHz
External data bus width - 4 4
JESD-30 code - R-PQFP-G128 R-PQFP-G128
JESD-609 code - e3 e3
length - 20 mm 20 mm
Humidity sensitivity level - 3 3
Number of I/O lines - 30 30
Number of terminals - 128 128
Maximum operating temperature - 70 °C 70 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - FQFP FQFP
Encapsulate equivalent code - QFP128,.67X.93,20 QFP128,.67X.93,20
Package shape - RECTANGULAR RECTANGULAR
Package form - FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius) - 260 260
power supply - 5 V 5 V
Certification status - Not Qualified Not Qualified
RAM (number of words) - 256 256
Maximum seat height - 3.32 mm 3.32 mm
Maximum supply voltage - 5.5 V 5.5 V
Minimum supply voltage - 4.5 V 4.5 V
Nominal supply voltage - 5 V 5 V
surface mount - YES YES
technology - CMOS CMOS
Temperature level - COMMERCIAL COMMERCIAL
Terminal surface - Matte Tin (Sn) Matte Tin (Sn)
Terminal form - GULL WING GULL WING
Terminal pitch - 0.5 mm 0.5 mm
Terminal location - QUAD QUAD
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED
width - 14 mm 14 mm
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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