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W83627HG-AW

Description
winbond lpc I/O
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1004KB,131 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
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W83627HG-AW Overview

winbond lpc I/O

W83627HG-AW Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWinbond Electronics Corporation
Parts packaging codeQFP
package instructionFQFP, QFP128,.67X.93,20
Contacts128
Reach Compliance Codecompliant
Address bus width4
boundary scanNO
Bus compatibilityLPC
maximum clock frequency48 MHz
External data bus width4
JESD-30 codeR-PQFP-G128
JESD-609 codee3
length20 mm
Humidity sensitivity level3
Number of I/O lines30
Number of terminals128
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFQFP
Encapsulate equivalent codeQFP128,.67X.93,20
Package shapeRECTANGULAR
Package formFLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
RAM (number of words)256
Maximum seat height3.32 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1
W83627HF/F
W83627HG/G
Winbond LPC I/O
Date: 2006/06/09
Revision: 2.27

W83627HG-AW Related Products

W83627HG-AW W83627G-AW W83627HG
Description winbond lpc I/O winbond lpc I/O winbond lpc I/O
Is it Rohs certified? conform to conform to -
Maker Winbond Electronics Corporation Winbond Electronics Corporation -
Parts packaging code QFP QFP -
package instruction FQFP, QFP128,.67X.93,20 PLASTIC, QFP-128 -
Contacts 128 128 -
Reach Compliance Code compliant unknow -
Address bus width 4 4 -
boundary scan NO NO -
Bus compatibility LPC LPC -
maximum clock frequency 48 MHz 48 MHz -
External data bus width 4 4 -
JESD-30 code R-PQFP-G128 R-PQFP-G128 -
JESD-609 code e3 e3 -
length 20 mm 20 mm -
Humidity sensitivity level 3 3 -
Number of I/O lines 30 30 -
Number of terminals 128 128 -
Maximum operating temperature 70 °C 70 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code FQFP FQFP -
Encapsulate equivalent code QFP128,.67X.93,20 QFP128,.67X.93,20 -
Package shape RECTANGULAR RECTANGULAR -
Package form FLATPACK, FINE PITCH FLATPACK, FINE PITCH -
Peak Reflow Temperature (Celsius) 260 260 -
power supply 5 V 5 V -
Certification status Not Qualified Not Qualified -
RAM (number of words) 256 256 -
Maximum seat height 3.32 mm 3.32 mm -
Maximum supply voltage 5.5 V 5.5 V -
Minimum supply voltage 4.5 V 4.5 V -
Nominal supply voltage 5 V 5 V -
surface mount YES YES -
technology CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL -
Terminal surface Matte Tin (Sn) Matte Tin (Sn) -
Terminal form GULL WING GULL WING -
Terminal pitch 0.5 mm 0.5 mm -
Terminal location QUAD QUAD -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED -
width 14 mm 14 mm -

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