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W83627SF-AW

Description
winbond I/O
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,147 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
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W83627SF-AW Overview

winbond I/O

W83627SF-AW Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionFQFP, QFP128,.67X.93,20
Contacts128
Reach Compliance Codeunknow
Address bus width4
boundary scanNO
Bus compatibilityPC-AT; PS/2; LPC
maximum clock frequency48 MHz
External data bus width4
JESD-30 codeR-PQFP-G128
JESD-609 codee0
length20 mm
Number of I/O lines50
Number of terminals128
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFQFP
Encapsulate equivalent codeQFP128,.67X.93,20
Package shapeRECTANGULAR
Package formFLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.32 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1
W83627SF
WINBOND I/O

W83627SF-AW Related Products

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