TA31101P datasheet, PDF - EEWORLD Datasheet

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TA31101P: Descriptioncompander IC for cordless telephone; CategoryWireless rf/communication Telecom circuit; File Size712KB，12 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TA31101P Overview

compander IC for cordless telephone

TA31101P Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	unknow
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
length	19.25 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	75 °C
Minimum operating temperature	-25 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/9 V
Certification status	Not Qualified
Maximum seat height	4.45 mm
Maximum slew rate	5 mA
Nominal supply voltage	3 V
surface mount	NO
technology	BIPOLAR
Telecom integrated circuit types	CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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TA31101P Related Products

	TA31101P	TA31101F	TA31101	TA31101AP	TA31101AF
Description	compander IC for cordless telephone	compander IC for cordless telephone	compander IC for cordless telephone	compander IC for cordless telephone	compander IC for cordless telephone
Is it lead-free?	Contains lead	Contains lead	-	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible
Maker	Toshiba Semiconductor	Toshiba Semiconductor	-	Toshiba Semiconductor	Toshiba Semiconductor
Parts packaging code	DIP	SOIC	-	DIP	SOIC
package instruction	DIP, DIP16,.3	SSOP, SOP16,.25,40	-	DIP, DIP16,.3	SSOP, SOP16,.25,40
Contacts	16	16	-	16	16
Reach Compliance Code	unknow	unknow	-	unknow	unknow
JESD-30 code	R-PDIP-T16	R-PDSO-G16	-	R-PDIP-T16	R-PDSO-G16
JESD-609 code	e0	e0	-	e0	e0
length	19.25 mm	8.2 mm	-	19.25 mm	8.2 mm
Number of functions	1	1	-	1	1
Number of terminals	16	16	-	16	16
Maximum operating temperature	75 °C	75 °C	-	75 °C	75 °C
Minimum operating temperature	-25 °C	-25 °C	-	-25 °C	-25 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SSOP	-	DIP	SSOP
Encapsulate equivalent code	DIP16,.3	SOP16,.25,40	-	DIP16,.3	SOP16,.25,40
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, SHRINK PITCH	-	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8/9 V	1.8/9 V	-	1.8/9 V	1.8/9 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	4.45 mm	1.9 mm	-	4.45 mm	1.9 mm
Maximum slew rate	5 mA	5 mA	-	5 mA	5 mA
Nominal supply voltage	3 V	3 V	-	3 V	3 V
surface mount	NO	YES	-	NO	YES
technology	BIPOLAR	BIPOLAR	-	BIPOLAR	BIPOLAR
Telecom integrated circuit types	CORDLESS TELEPHONE SUPPORT CIRCUIT	CORDLESS TELEPHONE SUPPORT CIRCUIT	-	CORDLESS TELEPHONE SUPPORT CIRCUIT	CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	-	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	-	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1 mm	-	2.54 mm	1 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	4.6 mm	-	7.62 mm	4.6 mm

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