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TA31101F

Description
compander IC for cordless telephone
CategoryWireless rf/communication    Telecom circuit   
File Size712KB,12 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TA31101F Overview

compander IC for cordless telephone

TA31101F Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeSOIC
package instructionSSOP, SOP16,.25,40
Contacts16
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G16
JESD-609 codee0
length8.2 mm
Number of functions1
Number of terminals16
Maximum operating temperature75 °C
Minimum operating temperature-25 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSOP16,.25,40
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8/9 V
Certification statusNot Qualified
Maximum seat height1.9 mm
Maximum slew rate5 mA
Nominal supply voltage3 V
surface mountYES
technologyBIPOLAR
Telecom integrated circuit typesCORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width4.6 mm

TA31101F Related Products

TA31101F TA31101P TA31101 TA31101AP TA31101AF
Description compander IC for cordless telephone compander IC for cordless telephone compander IC for cordless telephone compander IC for cordless telephone compander IC for cordless telephone
Is it lead-free? Contains lead Contains lead - Contains lead Contains lead
Is it Rohs certified? incompatible incompatible - incompatible incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor - Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code SOIC DIP - DIP SOIC
package instruction SSOP, SOP16,.25,40 DIP, DIP16,.3 - DIP, DIP16,.3 SSOP, SOP16,.25,40
Contacts 16 16 - 16 16
Reach Compliance Code unknow unknow - unknow unknow
JESD-30 code R-PDSO-G16 R-PDIP-T16 - R-PDIP-T16 R-PDSO-G16
JESD-609 code e0 e0 - e0 e0
length 8.2 mm 19.25 mm - 19.25 mm 8.2 mm
Number of functions 1 1 - 1 1
Number of terminals 16 16 - 16 16
Maximum operating temperature 75 °C 75 °C - 75 °C 75 °C
Minimum operating temperature -25 °C -25 °C - -25 °C -25 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP DIP - DIP SSOP
Encapsulate equivalent code SOP16,.25,40 DIP16,.3 - DIP16,.3 SOP16,.25,40
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH IN-LINE - IN-LINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 1.8/9 V 1.8/9 V - 1.8/9 V 1.8/9 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.9 mm 4.45 mm - 4.45 mm 1.9 mm
Maximum slew rate 5 mA 5 mA - 5 mA 5 mA
Nominal supply voltage 3 V 3 V - 3 V 3 V
surface mount YES NO - NO YES
technology BIPOLAR BIPOLAR - BIPOLAR BIPOLAR
Telecom integrated circuit types CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT - CORDLESS TELEPHONE SUPPORT CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED - COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE - THROUGH-HOLE GULL WING
Terminal pitch 1 mm 2.54 mm - 2.54 mm 1 mm
Terminal location DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 4.6 mm 7.62 mm - 7.62 mm 4.6 mm
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