Wire Bondable
Chip Capacitor
WBC Capacitor Series
•
Silicon Dioxide/Silicon Nitride dielectric
•
Capacitance range from 10pF to 1000pF
•
Silicon substrate with gold or aluminum backing
IRC’s wire-bondable chip capacitors are based on the successful
TaNCAP
®
line of RC networks on silicon. The new chip capacitors have
the advantage of excellent performance in extremely small sizes ranging from
20 to 60 mils square.
Capacitors are 100% electrically tested with mil screening to MIL-STD-883 also available.
For demanding hybrid circuit and/or chip and wire applications, specify IRC’s WBC capacitor series.
Physical Data
C0404
Top Bonding Pad
Top Bonding Pad
C0606
C0303
C0505
Back of chip
C0202
Back of chip
Manufacturing Capabilities Data
Style
C0202
C0303
C0404
C0505
C0606
Size
0.020″± 0.001 sq.
(0.508mm ±0.025)
0.030″± 0.001 sq.
(0.762mm ±0.025)
0.040″± 0.001 sq.
(1.016mm ±0.025)
0.055″± 0.001 sq.
(1.397mm ±0.025)
0.060″± 0.001 sq.
(1.524mm ±0.025)
Capacitance Range
10pF to 51pF
33pF to 100pF
56pF to 220pF
160pF to 360pF
160pF to 1000pF
Voltage
40
55
50
20
20
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Capacitor Series Issue January 2009 Sheet 1 of 2
Wire Bondable
Chip Capacitor
Electrical Data
Capacitance Range
Dissipation Factor 1Khz, +25°C, 1V
RMS
Absolute Tolerance
Operating Temperature
Noise
Substrate Material
Substrate Thickness
Bond Pad Metallization
Backside
Dielectric
Passivation
10pF to 1000pF
0.5% min
to ±5%
-55°C to +125°C
<-30dB
Semiconductor Silicon (10KÅ SiO
2
minimum)
0.010˝ ±0.001
(0.254mm ±0.025)
Aluminum: 10KÅ minimum
Aluminum: 10KÅ minimum
Gold: 3KÅ minimum
Silicon Dioxide and/or Silicon Nitride
Silicon Dioxide or Silicon Nitride
Environmental Data
Test
Method
MIL-STD-202
Method 107
Test condition F
MIL-STD-202
Method 106
+25°C, 5 seconds
1.5 X rated voltage
MIL-STD-202
Method 108
125°C, 1000 hours
100 hours @ 150°C
ambient
Max
∆C
Ordering Data
Prefix
Style
C0202; C0303; C0404; C0505; C0606
WBC -
C0606
A
G
- 102 - K
Thermal Shock
Moisture
Resistance
Short
Time Overload
Life at Elevated
Temperature
High Temperature
Exposure
±0.25% + 0.25pF max
Bonding pads
A = Aluminum
±1.0% + 0.25pF max
Backside
A = Aluminum; G = Gold
±0.25% + 0.25pF mx
Capacitance
3-Digit Capacitance Code
Ex: 102 = 1000pF; 221 = 220pF; 470 = 47pF
Absolute Tolerance Code
±0.25% + 0.25pF max
M = ±20%; K = ±10%; J = ±5%
±0.25% + 0.25pF max
Standard packaging is 2˝ x 2˝ chip tray. For additional information
or to discuss your specific requirements, please contact our
Applications Team using the contact details below.
Packaging
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Capacitor Series Issue January 2009 Sheet 2 of 2
Embedded System
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