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TC58FVM6T2AFT65

Description
toshiba mos digital integrated circuit silicon gate Cmos
Categorystorage    storage   
File Size756KB,61 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TC58FVM6T2AFT65 Overview

toshiba mos digital integrated circuit silicon gate Cmos

TC58FVM6T2AFT65 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSOP1
package instruction12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts48
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Maximum access time75 ns
Spare memory width8
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
length18.4 mm
memory density67108864 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,127
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
page size8/16 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.00001 A
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width12 mm
Base Number Matches1
TC58FVM6(T/B)2A(FT/XB)65
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
64MBIT (8M
×
8 BITS/4M
×
16 BITS) CMOS FLASH MEMORY
DESCRIPTION
The TC58FVM6T2A/B2A is a 67108864-bit, 3.0-V read-only electrically erasable and programmable flash
memory organized as 8388608 words
×
8 bits or as 4194304 words
×
16 bits. The TC58FVM6T2A/B2A features
commands for Read, Program and Erase operations to allow easy interfacing with microprocessors. The commands
are based on the JEDEC standard. The Program and Erase operations are automatically executed in the chip. The
TC58FVM6T2A/B2A also features a Simultaneous Read/Write operation so that data can be read during a Write or
Erase operation.
FEATURES
Power supply voltage
V
DD
=
2.3 V~3.6 V
Operating temperature
Ta
= −40°C~85°C
Organization
8M
×
8 bits/4M
×
16 bits
Functions
Simultaneous Read/Write
Page Read
Auto Program, Auto Page Program
Auto Block Erase, Auto Chip Erase
Fast Program Mode/Acceleration Mode
Program Suspend/Resume
Erase Suspend/Resume
data polling/Toggle bit
block protection, boot block protection
Automatic Sleep, support for hidden ROM area
common flash memory interface (CFI)
Byte/Word Modes
Block erase architecture
8
×
8 Kbytes/127
×
64 Kbytes
Boot block architecture
TC58FVM6T2A: top boot block
TC58FVM6B2A: bottom boot block
Mode control
Compatible with JEDEC standard commands
Erase/Program cycles
10
5
cycles typ.
Access Time (Random/Page)
V
DD
2.7~3.6 V
2.3~3.6 V
CL = 30 pF
65 ns/25 ns
70 ns/30 ns
CL = 100 pF
70 ns/30 ns
75 ns/35 ns
Power consumption
10
µA
(Standby)
15 mA (Program/Erase operation)
55 mA (Random Read operation)
11 mA (Address Increment Read operation)
5 mA (Page Read operation)
Package
TC58FVM6**AFT:
TSOPI48-P-1220-0.50 (weight: 0.51 g)
TC58FVM6**AXB:
P-TFBGA56-0710-0.80AZ (weight: 0.125 g)
2003-01-29
1/61

TC58FVM6T2AFT65 Related Products

TC58FVM6T2AFT65 TC58FVM62A TC58FVM6T2AXB65 TC58FVM6B2AXB65 TC58FVM6B2AFT65
Description toshiba mos digital integrated circuit silicon gate Cmos toshiba mos digital integrated circuit silicon gate Cmos toshiba mos digital integrated circuit silicon gate Cmos toshiba mos digital integrated circuit silicon gate Cmos toshiba mos digital integrated circuit silicon gate Cmos
Is it Rohs certified? incompatible - incompatible incompatible incompatible
Parts packaging code TSOP1 - BGA BGA TSOP1
package instruction 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 - 7 X 10 MM, 0.80 MM PITCH, PLASTIC, TFBGA-56 7 X 10 MM, 0.80 MM PITCH, PLASTIC, TFBGA-56 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts 48 - 56 56 48
Reach Compliance Code unknow - unknow unknow unknown
ECCN code 3A991.B.1.A - 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 75 ns - 75 ns 75 ns 75 ns
Spare memory width 8 - 8 8 8
startup block TOP - TOP BOTTOM BOTTOM
command user interface YES - YES YES YES
Universal Flash Interface YES - YES YES YES
Data polling YES - YES YES YES
JESD-30 code R-PDSO-G48 - R-PBGA-B56 R-PBGA-B56 R-PDSO-G48
length 18.4 mm - 10 mm 10 mm 18.4 mm
memory density 67108864 bi - 67108864 bi 67108864 bi 67108864 bit
Memory IC Type FLASH - FLASH FLASH FLASH
memory width 16 - 16 16 16
Number of functions 1 - 1 1 1
Number of departments/size 8,127 - 8,127 8,127 8,127
Number of terminals 48 - 56 56 48
word count 4194304 words - 4194304 words 4194304 words 4194304 words
character code 4000000 - 4000000 4000000 4000000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C - 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C
organize 4MX16 - 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 - TFBGA TFBGA TSOP1
Encapsulate equivalent code TSSOP48,.8,20 - BGA56,8X12,32 BGA56,8X12,32 TSSOP48,.8,20
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
page size 8/16 words - 8/16 words 8/16 words 8/16 words
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.5/3.3 V - 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
Programming voltage 3 V - 3 V 3 V 3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
ready/busy YES - YES YES YES
Maximum seat height 1.2 mm - 1.2 mm 1.2 mm 1.2 mm
Department size 8K,64K - 8K,64K 8K,64K 8K,64K
Maximum standby current 0.00001 A - 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate 0.07 mA - 0.07 mA 0.07 mA 0.07 mA
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.3 V - 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 3 V - 3 V 3 V 3 V
surface mount YES - YES YES YES
technology CMOS - CMOS CMOS CMOS
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING - BALL BALL GULL WING
Terminal pitch 0.5 mm - 0.8 mm 0.8 mm 0.5 mm
Terminal location DUAL - BOTTOM BOTTOM DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES - YES YES YES
type NOR TYPE - NOR TYPE NOR TYPE NOR TYPE
width 12 mm - 7 mm 7 mm 12 mm

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