TZA3019CHT datasheet, PDF - EEWORLD Datasheet

TZA3019CHT: Description2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch; CategoryWireless rf/communication Telecom circuit; File Size173KB，32 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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TZA3019CHT Overview

2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	QFP
package instruction	HTFQFP,
Contacts	32
Reach Compliance Code	unknow
app	SONET;SDH
JESD-30 code	S-PQFP-G32
length	5 mm
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HTFQFP
Package shape	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.2 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	5 mm

INTEGRATED CIRCUITS

DATA SHEET

TZA3019

2.5 Gbits/s dual

postamplifier with level

detectors and 2

2 switch

Preliminary speciﬁcation

File under Integrated Circuits, IC19

2000 Apr 10

	TZA3019CHT	TZA3019CV	TZA3019BV
Description	2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch	2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch	2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch
Maker	NXP	NXP	NXP
Parts packaging code	QFP	BCC	BCC
package instruction	HTFQFP,	HVBCC,	HVBCC,
Contacts	32	32	32
Reach Compliance Code	unknow	unknow	unknow
JESD-30 code	S-PQFP-G32	S-PBCC-B32	S-PBCC-B32
length	5 mm	5 mm	5 mm
Number of functions	1	1	1
Number of terminals	32	32	32
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HTFQFP	HVBCC	HVBCC
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	0.8 mm	0.8 mm
surface mount	YES	YES	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	BUTT	BUTT
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	BOTTOM	BOTTOM
width	5 mm	5 mm	5 mm
Manufacturer packaging code	-	SOT-560-1	SOT-560-1
Negative supply voltage rating	-	-3.3 V	-3.3 V

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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