TZA3019BV datasheet, PDF - EEWORLD Datasheet

TZA3019BV: Description2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch; CategoryWireless rf/communication Telecom circuit; File Size173KB，32 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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TZA3019BV Overview

2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	BCC
package instruction	HVBCC,
Contacts	32
Manufacturer packaging code	SOT-560-1
Reach Compliance Code	unknow
JESD-30 code	S-PBCC-B32
length	5 mm
Negative supply voltage rating	-3.3 V
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVBCC
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Certification status	Not Qualified
Maximum seat height	0.8 mm
surface mount	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	BUTT
Terminal pitch	0.5 mm
Terminal location	BOTTOM
width	5 mm

INTEGRATED CIRCUITS

DATA SHEET

TZA3019

2.5 Gbits/s dual

postamplifier with level

detectors and 2

2 switch

Preliminary speciﬁcation

File under Integrated Circuits, IC19

2000 Apr 10

	TZA3019BV	TZA3019CV	TZA3019CHT
Description	2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch	2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch	2.5 gbits/s dual postamplifier with level detectors and 2 x 2 switch
Maker	NXP	NXP	NXP
Parts packaging code	BCC	BCC	QFP
package instruction	HVBCC,	HVBCC,	HTFQFP,
Contacts	32	32	32
Reach Compliance Code	unknow	unknow	unknow
JESD-30 code	S-PBCC-B32	S-PBCC-B32	S-PQFP-G32
length	5 mm	5 mm	5 mm
Number of functions	1	1	1
Number of terminals	32	32	32
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVBCC	HVBCC	HTFQFP
Package shape	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	0.8 mm	0.8 mm	1.2 mm
surface mount	YES	YES	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BUTT	BUTT	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	QUAD
width	5 mm	5 mm	5 mm
Manufacturer packaging code	SOT-560-1	SOT-560-1	-
Negative supply voltage rating	-3.3 V	-3.3 V	-

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