TC55257PFL-55V datasheet, PDF - EEWORLD Datasheet

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TC55257PFL-55V: Description32,768-word BY 8-bit static ram; File Size498KB，13 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC55257PFL-55V Overview

32,768-word BY 8-bit static ram

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TC55257PFL-55V Related Products

	TC55257PFL-55V	TC55257DTRL-70V	TC55257DPL-55V	TC55257DTRL-85V	TC55257PFL-70V	TC55257PFL-85V	TC55257DFTL-85V	TC55257DPL-85V	TC55257DPL-70V
Description	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram	32,768-word BY 8-bit static ram
Parts packaging code	-	TSOP	DIP	TSOP	-	-	TSOP	DIP	DIP
package instruction	-	TSOP1-R, TSSOP28,.53,22	0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-28	TSOP1-R, TSSOP28,.53,22	-	-	0.55 MM PITCH, PLASTIC, TSOP1-28	DIP, DIP28,.6	0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-28
Contacts	-	28	28	28	-	-	28	28	28
Reach Compliance Code	-	unknow	unknow	unknow	-	-	unknow	unknow	unknow
Maximum access time	-	120 ns	55 ns	150 ns	-	-	85 ns	150 ns	70 ns
JESD-30 code	-	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28	-	-	R-PDSO-G28	R-PDIP-T28	R-PDIP-T28
length	-	11.8 mm	37 mm	11.8 mm	-	-	11.8 mm	37 mm	37 mm
memory density	-	262144 bi	262144 bi	262144 bi	-	-	262144 bi	262144 bi	262144 bi
Memory IC Type	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	8	8	8	-	-	8	8	8
Number of functions	-	1	1	1	-	-	1	1	1
Number of ports	-	1	1	1	-	-	1	1	1
Number of terminals	-	28	28	28	-	-	28	28	28
word count	-	32768 words	32768 words	32768 words	-	-	32768 words	32768 words	32768 words
character code	-	32000	32000	32000	-	-	32000	32000	32000
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	70 °C	-	-	70 °C	70 °C	70 °C
organize	-	32KX8	32KX8	32KX8	-	-	32KX8	32KX8	32KX8
Output characteristics	-	3-STATE	3-STATE	3-STATE	-	-	3-STATE	3-STATE	3-STATE
Exportable	-	YES	YES	YES	-	-	YES	YES	YES
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TSOP1-R	DIP	TSOP1-R	-	-	TSOP1	DIP	DIP
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE	IN-LINE	SMALL OUTLINE, THIN PROFILE	-	-	SMALL OUTLINE, THIN PROFILE	IN-LINE	IN-LINE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	-	-	PARALLEL	PARALLEL	PARALLEL
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.2 mm	5.3 mm	1.2 mm	-	-	1.2 mm	5.3 mm	5.3 mm
Minimum standby current	-	2 V	2 V	2 V	-	-	2 V	2 V	2 V
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	-	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V	-	-	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	-	3.3 V	5 V	3.3 V	-	-	5 V	3.3 V	5 V
surface mount	-	YES	NO	YES	-	-	YES	NO	NO
technology	-	CMOS	CMOS	CMOS	-	-	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	-	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	-	GULL WING	THROUGH-HOLE	GULL WING	-	-	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	-	0.55 mm	2.54 mm	0.55 mm	-	-	0.55 mm	2.54 mm	2.54 mm
Terminal location	-	DUAL	DUAL	DUAL	-	-	DUAL	DUAL	DUAL
width	-	8 mm	15.24 mm	8 mm	-	-	8 mm	15.24 mm	15.24 mm

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