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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
621/623 SERIES
Standard
P/N
621A
621K
623A
623K
Footprint
Dimensions
in. (mm)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 3.000 (76.2)
4.750 (120.6) x 3.000 (76.2)
Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
Height
in. (mm)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
Mounting
Hole Pattern
(1) TO-3
None
(1) TO-3
None
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
75°C @ 15W
75°C @ 15W
52°C @ 15W
52°C @ 15W
2.0°C/W @ 250 LFM
2.0°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
TO-3
Weight
lbs. (grams)
0.1000 (45.36)
0.1000 (45.36)
0.2100 (95.26)
0.210O (95.26)
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case
power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a
wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in
width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the
standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
A
K
Dimensions: in. (mm)
301/302/303 SERIES
Standard
P/N
301K
301M
301N
302M
302MM
302N
302NN
303M
303MM
303N
303NN
Outline
Dimensions
in. (mm)
Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
Length “A”
in. (mm)
0.750 (19.1)
0.750 (19.1)
0.750 (19.1)
1.500 (38.1)
1.500 (38.1)
1.500 (38.1)
1.500 (38.1)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
Mounting
Hole (s)
Pattern and Number
None
(1) 10-32UNF, 0.625 in. thread depth
(1)
1
⁄
4
-28UNF, 0.625 in. thread depth
(1) 10-32UNF, 0.625 in. thread depth
(2) 10-32UNF, 0.625 in. thread depth
(1)
1
⁄
4
-28UNF, 0.625 in. thread depth
(2)
1
⁄
4
-28UNF, 0.625 in. thread depth
(1) 10-32UNF, 0.625 in. thread depth
(2) 10-32UNF, 0.625 in. thread depth
(1)
1
⁄
4
-28UNF, 0.625 in. thread depth
(2)
1
⁄
4
-28UNF, 0.625 in. thread depth
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
70°C @ 15W
70°C @ 15W
70°C @ 15W
50°C @ 15W
50°C @ 15W
5O°C @ 15W
50°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
STUD-MOUNT
Weight
lbs. (grams)
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (6033)
0.1330 (60.33)
0.1330 (60.33)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and
“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
K
M
N
302 AND 303 SERIES
SERIES
301
302
303
301 SERIES
Dimensions: in. (mm)
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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
401 & 403 SERIES
Standard
P/N
401A
401F
401K
403A
403F
403K
Width
in. (mm)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
Double-Surface Heat Sinks for TO-3 Case Styles
Overall Dimensions
in. (mm)
1.500 (38.1)
1.500 (38.1)
1.500 (38.1)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
Height
in. (mm)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
Semiconductor
Mounting Hole Pattem
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
Thermal Performance at Typical Load
Natural Convection
Forced Convection
80°C @ 30W
80°C @ 30W
80°C @ 30W
55°C @ 30W
55°C @ 30W
55°C @ 30W
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
TO-3; Stud-Mount
Weight
lbs. (grams)
0.1500 (68.04)
0.1500 (68.04)
0.1500 (68.04)
0.3500 (158.76)
0.3500 (158.76
0.3500 (158.76)
With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are
recommended for critical space applications where maximum heat dissipation is required for
high-power TO-3 case styles. Forced convection performance is also exemplary with these
double surface fin types. Semiconductor mounting hole style “F” offers a single centered 0.270
in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for
mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request. Material:
Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
403 SERIES
401 SERIES
Dimensions: in. (mm)
A
SEMICONDUCTOR MOUNTING HOLES
F
K
V
401 AND 403 SERIES
(EXTRUSION
PROFILE 1024)
413/421/423 SERIES
Standard
P/N
413A
413F
413K
421A
421F
421K
423A
423K
Width
in. (mm)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes
Height “A”
in. (mm)
1.875 (47.6)
1.875 (47.6)
1.875 (47.6)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
TO-3; DO-5; Stud-Mount
Weight
lbs. (grams)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
1.1700 (530.71)
1.1700 (530.71)
Nominal Dimensions
Length
in. (mm)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
5.500 (140.2)
5.500 (140.2)
Semiconductor
Thermal Performance at Typical Load
Mounting Hole Pattern Natural Convection Forced Convection
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
None
72°C @ 50W
72°C @ 50W
72°C @ 50W
58°C @ 50W
58°C @ 50W
58°C @ 50W
47°C @ 50W
47°C @ 50W
0.85°C/W @ 250 LFM
0.85°C/W @ 250 LFM
0.85°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.5°C/W @ 250 LFM
0.5°C/W @ 250 LFM
Space-saving double surface 413, 421, and 423 Series utilize finned surface
area on both sides of the power semiconductor mounting surface to provide
maximum heat dissipation in a compact profile. Ready to install on popular
power components in natural and forced convection applications. Apply Wake-
field Type 126 silicone-free thermal compound or Wakefield DeltaPad™ inter-
face materials for maximum performance. Material: Aluminum Alloy, Black An-
odized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
413 SERIES
(EXTRUSION
PROFILE 2276)
421 SERIES
(EXTRUSION
PROFILE 1025)
423 SERIES
(EXTRUSION PROFILE 1025)
SEMICONDUCTOR MOUNTING HOLES
A
F
K
V
SERIES
413
421
Dimensions: in. (mm)
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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
431 & 433 SERIES
High-Performance Heat Sinks for 30-100W Metal Power Semiconductors
TO-3; Stud-Mount
Nominal Dimensions
Standard
Width
Length “A”
Height
Semiconductor
Thermal Performance at Typical Load
P/N
in. (mm)
in. (mm)
in. (mm) Mounting Hole Pattern Natural Convection
Forced Convection
431K
4.750 (120.7)
3.000 (76.2)
3.000 (76.2)
None
55°C @ 5OW
0.40°C/W @ 250 LFM
433K
4.750 (120.7)
5.500 (139.7)
3.000 (76.2)
None
42°C @ 5OW
0.28°C/W @ 250 LFM
Need maximum heat dissipation from a TO-3 rectifier heat sink in
minimum space? The Wakefield 431 and 433 Series center chan-
nel double-surface heat sinks offer the highest performance-to-weight ratio for minimum vol-
ume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to
Weight
lbs. (grams)
0.7800 (353.81)
1.4900 (675.86)
100-watt operating range. Additional interface resistance reduction for maximized overall per-
formance can be achieved with proper application of Wakefield Type 126 silicone-free thermal
compound. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SERIES
431
433
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR
MOUNTING HOLE
431 AND 433 SE-
RIES
(EXTRUSION PRO-
FILE 2726)
K
Dimensions: in. (mm)
435 SERIES
Standard
P/N
435AAAA
Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles
TO-3
Nominal Dimensions
Width
Length
Height
in. (mm)
in. (mm)
in. (mm)
4.250 (108.0)
5.500 (139.7)
4.300 (109.2)
Semiconductor
Thermal Performance at Typical Load
Weight
Mounting Hole Pattern Natural Convection Forced Convection
lbs. (grams)
(4) TO-3
37°C @ 50W
0.38°C/W @ 250 LFM 1.1500 (521.64)
54°C @ 80W
0.24°C/W @ 600 LFM
selection and installation of a Wakefield Type 175 DeltaPad Kapton™ interface material for
each power semiconductor or, for maximum reduction of case-to-sink interface loss, the appli-
cation of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black
Anodized.
This lightweight high-performance heat sink is designed to mount
and cool efficiently one to four TO-3 style metal case power semi-
conductors. The Type 435AAAA is the standard configuration available from stock, predrilled
for mounting four TO-3 style devices. Increased performance can be achieved with the proper
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR
MOUNTING HOLES
AAAA
435 SERIES
(EXTRUSION
PROFILE 4226)
441 SERIES
Standard
P/N
441K
High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes
Semiconductor
Mounting Hole Pattern
None
Thermal Performance at Typical Load
Natural Convection Forced Convection
34°C @ SOW
0.30°C/W @ 250 LFM
47°C @ 80W
0.19°C/W @ 600 LFM
Stud-Mount
Nominal Dimensions
Width
Length
Height
in. (mm)
in. (mm)
in. (mm)
4.750 (120.7) 5.500 (139.7) 4.500 (114.3)
Weight
lbs. (grams)
1.9700 (893.59)
Designed for vertical mounting within a power supply enclosure
or equipment cabinet without forced airflow available. This Wake-
field 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection with a
maximum 55°C heat sink temperature rise above ambient. When applied in a forced convec-
Dimensions: in. (mm)
tion environment, the 441K Type will achieve thermal resistance of 0.18°C/W (sink to ambient)
at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material: Aluminum
Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLE
K
441 SERIES
(EXTRUSION
PROFILE 1273)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
465 & 476 SERIES
Standard
P/N
465K
476K
476W
Width
in. (mm)
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes
Height
in. (mm)
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
Hex Style
Type
1.060 in. Hex
1.250 in. Hex
1.250 in. Hex
Mounting
Hole Pattern
None
None
0.765 in.
(19.4) Dia.
Center Mount
Thermal Performance at Typical Load
Natural Convection Forced Convection
38°C @ 5OW
25°C @ 5OW
25°C @ 5OW
0.27°C/W @ 500 LFM
0.19°C/W @ 500 LFM
0.19°C/W @ 500 LFM
Stud-Mount
Weight
lbs. (grams)
1.9300 (875.45)
2.8200 (1279.15)
2.8000 (1270.08)
Nominal Dimensions
Length
in. (mm)
5.000 (127.0)
6.000 (152.4)
6.000 (152.4)
Wakefield Engineering has designed four standard heat sink types for ease of installation and
efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount
power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are de-
signed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is available
predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black anodized.
MECHANICAL DIMENSIONS
465 SERIES (EXTRUSION
PROFILE 1244)
476 SERIES (EXTRUSION
PROFILE 1245)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
K
W
SEMICONDUCTOR
MOUNTING HOLES
Dimensions: in. (mm)
486 & 489 SERIES
Standard
P/N
486K
489K
Width
in. (mm)
6.250 (158.8)
6.250 (158.8)
Heat Sinks for High-Power Hex-Type Rectifiers and Diodes
Height
in. (mm)
6.250 (158.8)
6.250 (158.8)
Hex Style
Type
1.750 in. Hex
1.750 in. Hex
Mounting
Hole Pattern
None
None
Thermal Performance at Typical Load
Natural Convection Forced Convection
24°C @ 50W
86°C @ 250W
19°C @ 50W
75°C @ 250W
0.20°C/W @ 250 LFM
0.13°C/W @ 500 LFM
0.15°C/W @ 250 LFM
0.10°C/W @ 500 LFM
Stud-Mount
Weight
lbs. (grams)
4.2100 (1909.66)
6.1400 (2785.10)
Nominal Dimensions
Length
in. (mm)
6.000 (152.4)
9.000 (228.6)
These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for
mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000
in. (50.8) area on the semiconductor base mounting surface which is free of anodize. Material:
Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLE
K
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SERIES
486 AND 489 SERIES (EX-
TRUSION
PROFILE 1541)
Dimensions: in. (mm)
486
489
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Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
490 SERIES
Standard
P/N
490-35K
490-6K
490-12K
King Size Heat Sinks for High-Power Rectifiers
Nominal Dimensions
Length “A”
in. (mm)
3.500 (88.9)
6.000 (152.4)
12.000 (304.8)
Height
in. (mm)
6.750 (171.5)
6.750 (171.5)
6.750 (171.5)
Semiconductor
Mounting Hole Pattern
None
None
None
Thermal Performance at Typical Load
Natural Convection Forced Convection
84°C @ 20OW
60°C @ 20OW
45°C @ 20OW
0.18°C/W @ 600 LFM
0.13°C/W @ 600 LFM
0.09°C/W @ 600 LFM
GENERAL PURPOSE
Width
in. (mm)
9.250 (235.0)
9.250 (235.0)
9.250 (235.0)
Weight
lbs. (grams)
3.2400 (1469.66)
5.4700 (2481.19)
10.6200 (4817.23)
The 490 Series can be used to mount a single high-power rectifier or a grouping of smaller
power devices. The semiconductor device mounting surface is free of anodize on the entire
surface on one side only; finish overall is black anodize. Use Type 109 mounting brackets (see
accessories section) for mounting to enclosure wall and for electrical isolation. The anodize-
free mounting surface is milled for maximum contact area. The 490 Series Can also be drilled
for mounting and cooling IGBTs and other isolated power modules. Material: Aluminum Alloy,
Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLE
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
490 SERIES
(EXTRUSION PROFILE 2131)
Dimensions: in. (mm)
PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S
394, 395, 396 SERIES
Standard
P/N
Overall Dimensions: in. (mm)
Length
Height
in. (mm)
in. (mm)
Width
in. (mm)
Device Base
Mounting Area
(mm)
Base Mounting
Holes
4
6
4
6
4
6
Thermal Resistance at Typical Load
Natural
Forced
Convection (Øsa)
(1)
Convection (Øsa)
(°C/W)
(°C/W @ 500 LFM)
1.85
1.51
1.10
0.90
1.85
1.51
0.90
0.60
0.50
0.32
1.07
0.64
394-1AB
3.000 (76.2)
1.500 (38.1)
5.000 (127.0)
101 x 76
394-2AB
5.500 (139.7)
1.500 (38.1)
5.000 (127.0)
101 x 139
395-1AB
3.000 (76.2)
2.500 (63.5)
5.000 (127.0)
50 x 76
395-2AB
5.500 (139.7)
2.500 (63.5)
5.000 (127.0)
50 x 139
396-1AB
3.000 (76.2)
1.380 (35.1)
5.000 (127.0)
50 x 76
396-2AB
5.500 (139.7)
1.380 (35.1)
5.000 (127.0)
50 x 139
Note:
1.Thermal resistance values shown are for black anodized finish at 50°C rise above ambient.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
394 SERIES
(EXTRUSION PROFILE 7332)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
395 SERIES
(EXTRUSION PROFILE 7330)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
396 SERIES
(EXTRUSION PROFILE 7331)
Dimensions: in. (mm)
49
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