PIN Photodiodes
PNZ331F
(PN331F)
PIN Photodiode
ø5.4±0.1
ø4.6±0.05
ø2.4±0.1
Unit : mm
1.
0.
0
±
1
Features
3.2±0.05
M
ain
Di
sc te
on na
tin nc
ue e/
d
Metal package with shield pin
High quantum efficiency
High-speed response
High coupling capability suitable for plastic fiber and glass fiber
14.2±0.5
(0.3)
(0.5)
ø2.54±0.25
3-ø0.45±0.04
Absolute Maximum Ratings
(Ta = 25˚C)
Parameter
Symbol
V
R
P
D
Reverse voltage (DC)
Power dissipation
Operating ambient temperature
Storage temperature
T
opr
T
stg
Electro-Optical Characteristics
(Ta = 25˚C)
Parameter
Symbol
I
D
I
L
ue
Dark current
V
R
= 10V
Photo current
tin
V
R
= 10V, L = 1000 lx
*1
V
R
= 10V
V
R
= 10V, R
L
= 50Ω
V
R
= 10V
Peak sensitivity wavelength
ce
Capacitance between pins
Photodetection sensitivity
/D
Frequency characteristics
isc
λ
P
C
t
R
θ
D
f
C*2
an
V
R
= 10V,
λ
= 800nm
Acceptance half angle
Measured from the optical axis to the half power point
Effective photodetection area
Photodetection surface shape
Note 1) Spectral sensitivity : Sensitivity at wavelengths exceeding 400 nm as a percentage, is 100% to maximum sensitivity.
Note 2) This product is not designed to withstand electromagnetic radiation or heavy-charge particles.
Note 3) The glass strength of this product cannot withstand loads of 0.5 kg or greater. This fact needs to be taken into consideration
if optical fibers are to be mounted on the product.
Measurements were made using a tungsten lamp (color temperature T = 2856K) as a light source.
*2
Switching time measurement circuit (see figure below) Note : Detection photo current –3 dB
*1
Sig.IN
λ
P
= 800nm
50Ω
V
R
= 10V
(Input pulse)
Sig.OUT
(Output pulse)
R
L
t
d
t
r
t
f
90%
10%
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45
±
3˚
2
3
1
1.
0
±
0.
1
For optical fiber communication systems
Ratings
30
50
Unit
V
mW
˚C
˚C
1: Anode
2: Case
3: Cathode
Dimensions of detection area
1.1
0.88
Unit : mm
– 25 to +100
– 40 to +100
Active region
A1
ø0.1
Conditions
min
4
typ
0.1
7
max
10
Unit
nA
µA
nm
pF
on
900
50
3
MHz
A/W
deg.
mm
0.45
0.55
40
Ma
int
en
0.88
t
d
: Delay time
t
r
: Rise time (Time required for the collector photo current
to increase from 10% to 90% of its final value)
t
f
: Fall time (Time required for the collector photo current
to decrease from 90% to 10% of its initial value)
Note) The part number in the parenthesis shows conventional part number.
1
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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Embedded System
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