TLWJ1100T11 datasheet, PDF - EEWORLD Datasheet

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TLWJ1100T11: Descriptionpanel circuit indicator; File Size274KB，9 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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panel circuit indicator

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TLWJ1100(T11)

TOSHIBA LED Lamps

TLWJ1100(T11)

Panel Circuit Indicator

•

Surface-mount devices

3.2 (L) × 2.8 (W) × 1.9 (H) mm

LED chip + phosphor

Luminous intensity : Iv = 750 mcd (typ.) @20mA

Color: White

Chromaticity (typ.) : Cx=0.32,Cy=0.31

Topr / Tstg = -40 to 100°C

Reflow soldering is possible

Applications: automotive use,

backlighting etc.

Standard embossed tape packing: T11 (2000/reel)

8-mm tape reel

Unit: mm

Color and Material

Product Name

TLWJ1100

Color

White

Material

InGaN

JEDEC

JEITA

TOSHIBA

―

4-3R1

Absolute Maximum Ratings

(Ta

25°C)

Characteristics

Forward Current

Power Dissipation

Operating Temperature

Storage Temperature

(Note 1)

Symbol

opr

stg

Rating

120

−40~100

Unit

°C

Weight: 0.035 g (typ.)

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Forward current derating

– Ta

(mA)

Allowable forward current

100

120

Ambient temperature

(°C)

2007-10-01

TLWJ1100(T11)

Packaging

These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid

moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air

before soldering and they should therefore be stored under the following conditions:

1. This moisture proof bag may be stored unopened within 12 months at the following conditions.

Temperature: 5°C~30°C

Humidity: 90% (max)

2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of

5°C to 30°C/60% RH or below.

3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to

pink) or the expiration date has passed, the devices should be baked in taping with reel.

After baking, use the baked devices within 72 hours, but perform baking only once.

Baking conditions: 60±5°C, for 12 to 24 hours.

Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.

4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.

Furthermore, prevent the devices from being destructed against static electricity for baking of it.

5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not

throw or drop the packed devices.

Mounting Method

Soldering

•

Reflow soldering

Temperature profile (example)

10 s max

(*)

240°C max

Package surface

temperature (°C)

140~160°C max

(*)

4°C/s max

(*)

4°C/s max

(*)

60~120 s max

(*)

Time

(s)

•

The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the

condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under

the above conditions.

Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of

opening the package.

Second reflow soldering

In case of second reflow soldering should be performed within 168 h of the first reflow under the above

conditions.

Storage conditions before the second reflow soldering: 30°C, 60% RH (max)

Make any necessary soldering corrections manually.

(only once at each soldering point)

Soldering iron

: 25 W

Temperature

: 300°C or less

Time

: within 3 s

If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba

sales representative.

Recommended soldering pattern

1.65

1.15

1.65

2.41

Unit: mm

2007-10-01

TLWJ1100T11 Related Products

	TLWJ1100T11	TLWJ1100
Description	panel circuit indicator	panel circuit indicator

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