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MT58L256L32D

Description
8mb: 512k x 18, 256k x 32/36 3.3V I/O, pipelined, dcd syncburst sram
File Size424KB,26 Pages
ManufacturerMicron
Websitehttp://www.micron.com/
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MT58L256L32D Overview

8mb: 512k x 18, 256k x 32/36 3.3V I/O, pipelined, dcd syncburst sram

8Mb: 512K x 18, 256K x 32/36
3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
8Mb SYNCBURST
SRAM
FEATURES
MT58L512L18D, MT58L256L32D,
MT58L256L36D
3.3V V
DD
, 3.3V I/O, Pipelined, Double-
Cycle Deselect
Fast clock and OE# access times
Single +3.3V +0.3V/-0.165V power supply (V
DD
)
Separate +3.3V isolated output buffer supply (V
DD
Q)
SNOOZE MODE for reduced-power standby
Common data inputs and data outputs
Individual BYTE WRITE control and GLOBAL WRITE
Three chip enables for simple depth expansion and
address pipelining
Clock-controlled and registered addresses, data I/Os
and control signals
Internally self-timed WRITE cycle
Burst control (interleaved or linear burst)
Automatic power-down for portable applications
100-pin TQFP package
165-pin FBGA package
Low capacitive bus loading
x18, x32, and x36 versions available
100-Pin TQFP*
165-Pin FBGA
(Preliminary Package Data)
OPTIONS
• Timing (Access/Cycle/MHz)
3.5ns/6ns/166 MHz
4.0ns/7.5ns/133 MHz
5ns/10ns/100 MHz
• Configurations
512K x 18
256K x 32
256K x 36
• Packages
100-pin TQFP (2-chip enable)
100-pin TQFP (3-chip enable)
165-pin, 13mm x 15mm FBGA
• Operating Temperature Range
Commercial (0°C to +70°C)
Part Number Example
MARKING
-6
-7.5
-10
MT58L512L18D
MT58L256L32D
MT58L256L36D
T
S
F
None
*JEDEC-standard MS-026 BHA (LQFP).
GENERAL DESCRIPTION
The Micron
®
SyncBurst
SRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
Micron’s 8Mb SyncBurst SRAMs integrate a 512K x
18, 256K x 32, or 256K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
controlled by a positive-edge-triggered single-clock in-
put (CLK). The synchronous inputs include all ad-
dresses, all data inputs, active LOW chip enable (CE#),
two additional chip enables for easy depth expansion
(CE2, CE2#), burst control inputs (ADSC#, ADSP#,
MT58L512L18DT-7.5
* A Part Marking Guide for the FBGA devices can be found on Micron’s
web site—http://www.micron.com/support/index.html.
8Mb: 512K x 18, 256K x 32/36 3.3V I/O, Pipelined, DCD SyncBurst SRAM
MT58L512L18D_2.p65 – Rev. 8/00
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.

MT58L256L32D Related Products

MT58L256L32D MT58L1MV18D MT58L256L36D MT58L512L18D
Description 8mb: 512k x 18, 256k x 32/36 3.3V I/O, pipelined, dcd syncburst sram 8mb: 512k x 18, 256k x 32/36 3.3V I/O, pipelined, dcd syncburst sram 8mb: 512k x 18, 256k x 32/36 3.3V I/O, pipelined, dcd syncburst sram 8mb: 512k x 18, 256k x 32/36 3.3V I/O, pipelined, dcd syncburst sram

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