EEWORLDEEWORLDEEWORLD

Part Number

Search

BU-61582F2-860

Description
Serial IO/Communication Controller, Hybrid, CDFP70
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size389KB,48 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric View All

BU-61582F2-860 Overview

Serial IO/Communication Controller, Hybrid, CDFP70

BU-61582F2-860 Parametric

Parameter NameAttribute value
Objectid104632947
Reach Compliance Codeunknown
JESD-30 codeR-XDFP-F70
Number of terminals70
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL70,1.0
Package shapeRECTANGULAR
Package formFLATPACK
power supply5,-12 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
surface mountYES
technologyHYBRID
Temperature levelCOMMERCIAL
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
BU-61582
SPACE LEVEL MIL-STD-1553
BC/RT/MT
ADVANCED COMMUNICATION
ENGINE (SP’ACE) TERMINAL
FEATURES
Make sure the next
Card you purchase
has...
®
Radiation-Hardened to 1 MRad
Fully Integrated 1553 Terminal
Flexible Processor Interface
16K x 16 Internal RAM
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Intelligent RT Data Buffering
Small Ceramic Package
Available to SMD 5962-96887
Multiple Ordering Options;
+5V (Only)
+5V/-15V
+5V/-12V
+5V/Transceiverless
+5V (Only, with Transmit Inhibits)
DESCRIPTION
DDC’s BU-61582 Space Advanced Communication Engine (SP’ACE)
is a radiation hardened version of the BU-61580 ACE terminal. DDC
supplies the BU-61582 with enhanced screening for space and other
high reliability applications.
The BU-61582 provides a complete integrated BC/RT/MT interface
between a host processor and a MIL-STD-1553 bus. The BU-61582
maintains functional and software compatibility with the standard BU-
61580 product and is packaged in the same 1.9 square-inch package
footprint.
As an option, DDC can supply the BU-61582 with space level screen-
ing. This entails enhancements in the areas of element evaluation and
screening procedures for active and passive elements, as well as the
manufacturing and screening processes used in producing the termi-
nals.
The BU-61582 integrates dual transceiver, protocol, memory man-
agement and processor interface logic, and 16K words of RAM in the
choice of 70-pin DIP or flat pack packages. Transceiverless versions
may be used with an external electrical or fiber optic transceiver.
To minimize board space and ‘glue’ logic, the SP’ACE terminals pro-
vide ultimate flexibility in interfacing to a host processor and inter-
nal/external RAM.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
© 1998, 1999 Data Device Corporation

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 488  1453  862  367  923  10  30  18  8  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号