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AR312RAAR22JLF

Description
General Purpose Inductor, 0.22uH, 5%, 1 Element, Ceramic-Core, SMD, CHIP, 0704
CategoryPassive components    inductor   
File Size153KB,3 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AR312RAAR22JLF Overview

General Purpose Inductor, 0.22uH, 5%, 1 Element, Ceramic-Core, SMD, CHIP, 0704

AR312RAAR22JLF Parametric

Parameter NameAttribute value
Objectid8232931280
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN codeEAR99
YTEOL7.7
uppercase and lowercase codes0603
structureRectangular
core materialCeramic
DC Resistance2.1 Ω
Nominal inductance(L)0.22 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
Number of functions1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-65 °C
Package height1.02 mm
Package length1.8 mm
Package formSMT
Package width1.12 mm
method of packingTR, Paper, 7 Inch
Minimum quality factor (at nominal inductance)25
Maximum rated current0.16 A
self resonant frequency760 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency100 MHz
Tolerance5%
0603 CHIP INDUCTORS
OutgassingCompliantChipInductors
AR312RAA
Exceptional Q and high SRFs
DCR and current carrying characteristics
Outstanding self-resonant frequency
Tight inductance tolerance
High temperature materials allow operation in ambient
temperatures up to 155°C.
Passes NASA low outgassing specifications
Standard tin-lead (Sn-Pb) terminations ensures the best
possible board adhesion. Note: Nickel barrier termination
(tin-lead over tin over nickel over silver-platinum-glass frit,
termination code P) is recommended for hand soldering
applications.
Core material
Ceramic
Terminations
Tin-lead (63/37) over tin over nickel over silver-platinum-
glass frit. Other terminations are also available.
Ambient temperature
–65°C to +125°C with
Imax
current
Maximum part temperature
+155°C (ambient + temp rise)
Storage temperature
Component: –65°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 1.0 mm thick, 4 mm pocket spacing
Typical L vs Frequency
200
175
120 nH
150
Inductance (nH)
125
100
75
50
25
0
10
100
1000
68 nH
33 nH
12 nH
3.9 nH
10000
Frequency (MHz)
Typical Q vs Frequency
120
110
100
90
80
3.9 nH
12 nH
Q Factor
70
60
50
40
30
20
10
0
B
overall
C
D
I
H
33 nH
68 nH
120 nH
F
A
G
F
J
I
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
Suggested
Land Pattern
1
10
100
1000
10000
Frequency (MHz)
A
max
0.071
1,80
B
max
0.044
1,12
C
max
1,02
D
ref
0,38
E
0,76
F
0,33
G
0,86
H
1,02
I
0,64
J
0,64
0.040 0.015 0.030 0.013 0.034 0.040 0.025 0.025
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
®
Document AR195-1 Revised 09/23/21
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.
© Coilcraft, Inc. 2021
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