Philips Semiconductors
Product specification
Zero standby power
CMOS versatile PAL devices
•
Industrial control
•
Medical Instruments
•
Portable communications equipment
PIN CONFIGURATIONS
PLC18V8Z
DESCRIPTION
The PLC18V8Z is a universal PAL® device featuring high
performance and virtually zero-standby power for power sensitive
applications. They are reliable, user-configurable substitutes for
discrete TTL/CMOS logic. While compatible with TTL and HCT
logic, the PLC18V8Z can also replace HC logic over the V
CC
range
of 4.5 to 5.5V.
The PLC18V8Z is a two-level logic element comprised of 10 inputs,
74 AND gates (product terms) and 8 output Macro cells.
Each output features an “Output Macro Cell” which can be
individually configured as a dedicated input, a combinatorial output,
or a registered output with internal feedback. As a result, the
PLC18V8Z is capable of emulating all common 20-pin PAL devices
to reduce documentation, inventory, and manufacturing costs.
A power-up reset function and a Register Preload function have
been incorporated in the PLC18V8Z architecture to facilitate state
machine design and testing.
With a standby current of less than 100µA and active power
consumption of 1.5mA/MHz, the PLC18V8Z is ideally suited for
power sensitive applications in battery operated/backed portable
instruments and computers.
The PLC18V8Z is also processed to industrial requirements for
operation over an extended temperature range of -40°C to +85°C
and supply voltage of 4.5V to 5.5V.
Ordering information can be found on the following page.
D, DB, DH, N, Packages
I0/CLK
I1
I2
I3
I4
I5
I6
I7
I8
1
2
3
4
5
6
7
8
9
20 V
CC
19 F7
18 F6
17 F5
16 F4
15 F3
14 F2
13 F1
12 F0
11 I9/OE
GND 10
D = Plasitc Small Outline Large Package (300mil-wide)
DB = Plastic Shrink Small Outline Package (5.3mm wide)
DH = Plastic Thin Shrink Small Outline Package (4.4mm wide)
N = Plastic Dual In-Line Package (DIP) (300mil-wide)
A Package
I2
I0/
I1 CLK V
CC
F7
2
1
20
19
18 F6
17 F5
16 F4
15 F3
14 F2
9
10
11
12
13
FEATURES
3
I3
I4
I5
I6
I7
4
5
6
7
8
•
20-pin Universal Programmable Array Logic
•
Virtually Zero-Standby-power
–
20µA (typical)
•
Available in DIP, PLCC, SOL (Small Outline), SSOP (Shrink Small
Outline), and TSSOP (Thin Shrink Small Outline) packages
•
Functional replacement for Series 20 PAL devices
•
Up to 18 inputs and 8 input/output macro cells
•
Programmable output polarity
•
Power-up reset on all registers
•
Register Preload capability
•
Synchronous Preset/Asynchronous Reset
•
Security fuse to prevent duplication of proprietary designs
•
Also available in 3V operation–the P3C18V8Z
APPLICATIONS
–
I
OL
= 24mA
I8 GND I9/ F0 F1
OE
A = Plastic Leaded Chip Carrier
SP00544
PIN DESCRIPTIONS
I
B
O
D
F
CLK
OE
Dedicated Input
Bidirectional input/output
Dedicated output
Registered output (D-type flip-flop)
Output/Input Macrocell
Clock Input
Output Enable
Supply Voltage
Ground
•
Battery powered instruments
•
Laptop and pocket computers
V
CC
GND
PAL is a registered trademark of Advanced Micro Devices, Inc.
1997 Aug 08
2
853–2016 18258
Philips Semiconductors
Product specification
Zero standby power
CMOS versatile PAL devices
PLC18V8Z
ORDERING INFORMATION
DESCRIPTION
20-Pin (300mil-wide) Plastic Dual In-Line Package, 25ns t
PD
20-Pin (350mil square) Plastic Leaded Chip Carrier Package
20-Pin (300mil-wide) Plastic Small Outline Large Package
20-Pin (5.3mm-wide) Plastic Shrink Small Outline Package
20-Pin (4.4mm-wide) Plastic Thin Shrink Small Outline Package
20–Pin (300mil–wide) Plastic Dual In–Line Package. 35ns t
PD
20–Pin (350mil square) Plastic Leaded Chip Carrier Package
20–Pin (300mil square) Plastic Small Outline Large Package Package
20–Pin (5.3mm–wide) Plastic Shrink Small Outline Package
20–Pin (4.4mm–wide) Plastic Thin shrink Small Outline Package
20-Pin (300mil-wide) Plastic Dual In-Line Package 25ns t
PD
20-Pin (350mil square) Plastic Leaded Chip Carrier Package
20-Pin (300mil-wide) Plastic Small Outline Large Package
20-Pin (5.3mm-wide) Plastic Shrink Small Outline Package
20-Pin (4.4mm-wide) Plastic Thin Shrink Small Outline Package
20–Pin (300mil–wide) Plastic Dual In–Line Package, 40ns t
PD
20–Pin (350mil square) Plastic Leaded chip Carrier Package
20–Pin (300mil square) Plastic Small Outline Large Package
20–Pin (5.3mm–wide) Plastic Shrink Small Outline Package
20–Pin (4.4mm–wide) Plastic Thin Shrink Small Outline Package
Industrial
Temperature Range
±
10% Power Supplies
Commercial
Temperature Range
±
5% Power Supplies
TEMPERATURE
RANGE
ORDER CODE
PLC18V8Z25N
PLC18V8Z25A
PLC18V8Z25D
PLC18V8Z25DB
PLC18V8Z25DH
PLC18V8Z35N
PLC18V8Z35A
PLC18V8Z35D
PLC18V8Z35DB
PLC18V8Z35DH
PLC18V8ZIAN
PLC18V8ZIAA
PLC18V8ZIAD
PLC18V8ZIADB
PLC18V8ZIADH
PLC18V8ZIN
PLC18V8ZIA
PLC18V8ZZID
PLC18V8ZIDB
PLC18V8ZIDH
DRAWING
NUMBER
SOT146-1
SOT380-1
SOT163-1
SOT339-1
SOT360-1
SOT146–1
SOT380–1
SOT163–1
SOT339–1
SOT260–1
SOT146-1
SOT380-1
SOT163-1
SOT339-1
SOT360-1
SOT146–1
SOT380–1
SOT163–1
SOT339–1
SOT360–1
1997 Aug 08
3
Philips Semiconductors
Product specification
Zero standby power
CMOS versatile PAL devices
PLC18V8Z
PAL DEVICE TO PLC18V8Z OUTPUT PIN CONFIGURATION CROSS REFERENCE
PIN
NO.
1
19
18
17
16
15
14
13
12
11
PLC
18V8Z
I
0
/CLK
F7
F6
F5
F4
F3
F2
F1
F0
I
9
/OE
16L8
16H8
16P8
16P8
I
B
B
B
B
B
B
B
B
I
16R4
16RP4
CLK
B
B
D
D
D
D
B
B
OE
16R6
16RP6
CLK
B
D
D
D
D
D
D
B
OE
16R8
16RP8
CLK
D
D
D
D
D
D
D
D
OE
16L2
16H2
16P2
I
I
I
I
O
O
I
I
I
I
14L4
14H4
14P4
I
I
I
O
O
O
O
I
I
I
12L6
12H6
12P6
I
I
O
O
O
O
O
O
I
I
10L8
10H8
10P8
I
O
O
O
O
O
O
O
O
I
The Philips Semiconductors’ state-of-the-art Floating-Gate CMOS
EPROM process yields bipolar equivalent performance at less than
one-quarter the power consumption. The erasable nature of the
EPROM process enables Philips Semiconductors to functionally test
the devices prior to shipment to the customer. Additionally, this
allows Philips Semiconductors to extensively stress test, as well as
ensure the threshold voltage of each individual EPROM cell. 100%
programming yield is subsequently guaranteed.
FUNCTIONAL DIAGRAM
I
0
/
CLK
9
I
1
PROGRAMMABLE AND ARRAY
36 ROWS X 72 COLUMNS
OMC
CLK
9
OMC
F
6
F
7
I
0
CONFIG.
CELL
I
2
9
OMC
F
1
I
7
9
I
8
SP
AR
OE
OMC
F
0
CONFIG.
CELL
I
9
I
9
/OE
SP00013
1997 Aug 08
4
Philips Semiconductors
Product specification
Zero standby power
CMOS versatile PAL devices
PLC18V8Z
LOGIC DIAGRAM
0
I0/CLK 1
DIR
SP
4
8
12
16
20
24
28
32
35
CLK
I1 2
DIR
AC1
AC2
AR
CLK
SP
OE
19 F7
I2
3
DIR
AC1
AC2
AR
CLK
SP
OE
18 F6
I3
4
DIR
AC1
AC2
AR
CLK
OE
SP
17 F5
I4
5
DIR
AC1
AC2
AR
CLK
OE
SP
16 F4
I5
6
DIR
AC1
AC2
AR
CLK
OE
SP
15 F3
I6
7
DIR
AC1
AC2
AR
CLK
OE
SP
14 F2
I7
8
DIR
AC1
AC2
AR
CLK
OE
SP
13 F1
I8
9
SP
AR
AC1
AC2
AR
CLK
OE
12 F0
11 I9/OE
CONFIG.
CELL
I1
I1
F7
F7
I2
I2
F6
F6
I3
I3
F5
F5
I4
I4
F4
F4
I5
I5
F3
F3
I6
I6
F2
F2
I7
I7
F1
F1
I8
I8
F0
F0
I0
I0
I9
I9
NOTES:
In the unprogrammed or virgin state:
All cells are in a conductive state.
All AND gate locations are pulled to a logic “0” (Low).
Output polarity is inverting.
Pins 1 and 11 are configured as Inputs 0 and 9, respectively, via the configuration cell. The clock and OE
functions are disabled.
All output macro cells (OMC) are configured as bidirectional I/O, with the outputs disabled via the direc-
tion term.
Denotes a programmable cell location.
SP00012
1997 Aug 08
5
Embedded System
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