EEWORLDEEWORLDEEWORLD

Part Number

Search

T1213EFR-X-.027-1.6-5

Description
Film Capacitor, Polypropylene, 160V, -300/-230ppm/Cel TC, 0.027uF, 5116
CategoryPassive components    capacitor   
File Size47KB,9 Pages
ManufacturerEFC [Electronic Film Capacitors, Inc.]
Download Datasheet Parametric View All

T1213EFR-X-.027-1.6-5 Overview

Film Capacitor, Polypropylene, 160V, -300/-230ppm/Cel TC, 0.027uF, 5116

T1213EFR-X-.027-1.6-5 Parametric

Parameter NameAttribute value
Objectid1205370199
package instruction, 5116
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.027 µF
Capacitor typeFILM CAPACITOR
Custom functionsConsult For Non-Standard Options
dielectric materialsPOLYPROPYLENE
high9 mm
length13 mm
Manufacturer's serial number1213EFR(160VDC)
negative tolerance5%
Number of terminals2
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
Package formRadial
positive tolerance5%
Rated (AC) voltage (URac)100 V
Rated (DC) voltage (URdc)160 V
series1213EFR(160VDC)
size code5116
Temperature Coefficient-300/-230ppm/Cel ppm/°C
Terminal pitch10 mm
width4 mm
ELECTRONIC FILM CAPACITORS, INC.
Reidville Industrial Park * 41 Interstate Lane
WATERBURY, CONNECTICUT 06705
PHONE (203) 755-5629
FAX (203) 755-0659
METALLIZED POLYPROPYLENE
SERIES 1213
EFC Series 1213 are metallized polypropylene capacitors. This series offers the advantage
of superior stability, self healing, high insulation resistance, low dissipation factor and high
frequency operation. Suggested applications include: timing circuits, switch mode power
supplies (SMPS). Packaging options include: wrap and fill (TF, TC), radial lead box (EFR),
axial lead (EC, EF). Application options include: switching power supply (SP).
SPECIFICATIONS
1. TEMPERATURE RANGE
- 55 C to + 85 C at rated voltage.
To 105
O
C with 25% voltage derating.
O
O
4. INSULATION RESISTANCE
At 25
O
C after 2 minutes charge time at rated voltage
or 500 VDC, whichever is less, the minimum IR shall
be 80,000 Megohm-Microfarads, but need not exceed
120,000 Megohms.
2. CAPACITANCE
Capacitors < 1.0 MFD shall be measured
_
at 1 KHz + 20 HZ. Capacitors >1.0 MFD
shall be measured at 60 HZ. Measurements
shall be taken at 25
O
C.
5. HUMIDITY RESISTANCE
Series 1213 shall meet the requirements
of MIL-STD. 202C, Method 103B.
3. DIELECTRIC STRENGTH
At 25
O
C, 150% of rated voltage when applied
terminal to terminal for one minute through a
current limiting resistance.
6. DISSIPATION FACTOR
Shall be 0.1 % max. when measured as in Par. 2.
7. LIFE TEST
Will withstand the application of 150% rated voltage at +85
0
C for 250 hours
with not more than one failure in 12 permitted.
TYPICAL TEMPERATURE CURVES
METALLIZED POLYPROPYLENE
CAPACITANCE CHANGE VS. TEMPERATURE
+2.0
% CAPACITANCE CHANGE
+1.0
0
-1.0
-2.0
-3.0
-4.0
-55
% DISSIPATION FACTOR
.15
DISSIPATION FACTOR VS. TEMPERATURE
.10
.05
0
-25
0
25
50
Temperature (
O
C)
85
105
-55
-25
0
25
50
Temperature (
O
C)
85
105
IR (MEGOHMS X Ufd.)
10
10
10
7
INSULATION RESISTANCE VS. TEMPERATURE
6
5
4
10
3
10
+25
+50
+85
+105
Temperature (
O
C)
I would like to ask you about the problem of making a PDA installation program: When I use the installation package to download a program to the PDA, the program name cannot be displayed in Chinese. How can I solve this problem?
I used ePocketSetup2001, ePocketSetup2003, ePocketSetup4 installation package making tools to make installation packages. The packaged programs were made with evc++. After Pocket PC 2003 was installed...
darkkingdom Embedded System
Quick, help me calculate the baud rate error problem, click here to see the picture and formula
Just the information on these three pictures. I want to know how the error values in the table below are calculated. I have been calculating for a long time but it doesn’t match up:Cry:...
shijizai stm32/stm8
Is it better to learn C language or assembly language for R&D work?
Is it better to learn C language or assembly language for R&D work? Which language is more widely used in work? Which one will be better for future development? And which language is easier to learn?...
hanshu61 MCU
Jlink prompts error message when burning external flash
[i=s]This post was last edited by Xiaoxiaoliaodou on 2019-12-30 10:58[/i]When I use jlin to burn external flash, the following prompt often appears: Burning fails. But it will be OK if I burn it again...
小小料豆 ARM Technology
Communication problem between host computer and USB device
Communication problem between host computer and USB device. The problem with mass storage protocol is that it cannot be used by non-administrators. Use fopen, fread, fwrite and other methods to access...
nsz Embedded System
Count the 2.4G RF chips in recent years!
Because of work, I started using 2.4G wireless in 2003, mainly in gaming peripherals. I've experienced the price drop from $6 or $7 per chip to less than $0.5 per chip now. The chips I've used include...
雪人001 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1243  1050  1116  1083  749  26  22  23  16  9 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号