MOTOROLA
Freescale Semiconductor, Inc.
Order Number: MPXAZ6115A
Rev. 1, 06/2004
SEMICONDUCTOR TECHNICAL DATA
Media Resistant and
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
MPXAZ6115A
MPXHZ6115A
SERIES
INTEGRATED
PRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 Volts Output
SMALL OUTLINE PACKAGE
Freescale Semiconductor, Inc...
Motorola's MPXAZ6115A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The sensor's packaging has been designed to provide
resistance to high humidity conditions as well as common automotive media. The
small form factor and high reliability of on-chip integration make the Motorola
pressure sensor a logical and economical choice for the system designer.
The MPXAZ6115A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
Features
• Resistant to High Humidity and Common Automotive Media
• Improved Accuracy at High Temperature
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from -40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
Application Examples
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute Pressure (MAP)
• Weather Station and Weather Reporting Devices
VS
MPXAZ6115A6U
CASE 482-01
MPXAZ6115AC6U
CASE 482A-01
PIN NUMBER
1
2
3
4
N/C
V
S
Gnd
V
out
5
6
7
8
N/C
N/C
N/C
N/C
NOTE:
Pins 1, 5, 6, 7, and 8 are internal
device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the
notch in the lead.
SUPER SMALL OUTLINE PACKAGE
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
Vout
MPXHZ6115A6U
CASE 1317-04
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor
Schematic
MPXAZ6115AC6U
CASE 1317A-03
© Motorola, Inc. 2004
For More Information On This Product,
Go to: www.freescale.com
MPXAZ6115A MPXHZ6115A SERIES
Freescale Semiconductor, Inc.
MAXIMUM RATINGS
(1)
Parametrics
Maximum Pressure (P1
>
P2)
Storage Temperature
Operating Temperature
Output Source Current @ Full Scale Output
(2)
Output Sink Current @ Minimum Pressure Offset
(2)
Symbol
P
max
T
stg
T
A
I
o
+
I
o
-
Value
400
-40° to +125°
-40° to +125°
0.5
-0.5
Units
kPa
°C
°C
mAdc
mAdc
NOTES:
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from V
out
to Gnd or V
out
to V
S
in the application circuit.
Freescale Semiconductor, Inc...
OPERATING CHARACTERISTICS
(V
S
= 5.0 Vdc, T
A
= 25°C unless otherwise noted, P1
>
P2.)
Characteristic
Pressure Range
Supply Voltage
(1)
Supply Current
Minimum Pressure Offset
(2)
@ V
S
= 5.0 Volts
Full Scale Output
(3)
@ V
S
= 5.0 Volts
Full Scale Span
(4)
@ V
S
= 5.0 Volts
Accuracy
(5)
Sensitivity
Response Time
(6)
Warm-Up Time
(7)
Offset Stability
(8)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Symbol
P
OP
V
S
I
o
V
off
V
FSO
V
FSS
-
V/P
t
R
-
-
Min
15
4.75
-
0.133
4.633
4.433
-
-
-
-
-
Typ
-
5.0
6.0
0.200
4.700
4.500
-
45.9
1.0
20
±0.25
Max
115
5.25
10
0.268
4.768
4.568
±1.5
-
-
-
-
Unit
kPa
Vdc
mAdc
Vdc
Vdc
Vdc
%V
FSS
mV/kPa
ms
ms
%V
FSS
NOTES:
1. Device is radiometric within this specified excitation range.
2. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25°C due to all sources of error including the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:
Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and
from minimum or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
6.
Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXAZ6115A
2
For More Information On This Product,
Go to: www.freescale.com
Motorola Sensor Device Data
Freescale Semiconductor, Inc.
MPXAZ6115A MPXHZ6115A SERIES
GEL DIE COAT
P1
WIRE BOND
LEAD
FRAME
DIE
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
100 nF
+5.0 V
VS Pin 2
MPXAZ6115A
Vout Pin 4
GND Pin 3
47 pF
51 K
to ADC
ABSOLUTE ELEMENT
SEALED VACUUM REFERENCE
DIE BOND
Freescale Semiconductor, Inc...
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
Figure 2 illustrates the absolute sensing chip in the basic
Small Outline chip carrier (Case 482).
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 3 shows a typical application circuit (output source
current operation).
5.0
4.5
4.0
OUTPUT (Volts)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
Pressure (ref: to sealed vacuum) in kPa
0
MIN
TRANSFER FUNCTION:
MAX
V
out
= V
s
* (.009*P-.095)
±
Error
V
S
= 5.0 Vdc
TEMP = 0 to 85°C
TYP
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pressure
input. Typical minimum and maximum output curves are shown
for operation over 0 to 85°C temperature range. The output will
saturate outside of the rated pressure range.
A gel die coat isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
The gel die coat and durable polymer package provide a
media resistant barrier that allows the sensor to operate reliably
in high humidity conditions as well as environments containing
common automotive media. Contact the factory for more
information regarding media compatibility in your specific
application.
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
MPXAZ6115A
3
MPXAZ6115A MPXHZ6115A SERIES
Freescale Semiconductor, Inc.
Transfer Function (MPXAZ6115A)
Nominal Transfer Value:
V
out
= V
S
x (0.009 x P - 0.095)
±
(Pressure Error x Temp. Factor x 0.009 x V
S
)
V
S
= 5.0
±
0.25 Vdc
Temperature Error Band
MPXAZ6115A Series
4.0
3.0
Temperature
Error
Factor
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C
Break Points
Temp
- 40
0 to 85
125
Multiplier
3
1
1.75
Freescale Semiconductor, Inc...
Pressure Error Band
3.0
Pressure Error (kPa)
2.0
1.0
0.0
-1.0
-2.0
-3.0
Pressure
Error (Max)
15 to 115 (kPa)
±1.5
(kPa)
20
40
60
80
100
120
Pressure (in kPa)
Error Limits for Pressure
ORDERING INFORMATION—SMALL OUTLINE PACKAGE
Device Type
Basic Element
Ported Element
Options
Absolute, Element Only
Absolute, Element Only
Absolute, Axial Port
Absolute, Axial Port
Case No.
482
482
482A
482A
MPX Series Order No.
MPXAZ6115A6U
MPXAZ6115A6T1
MPXAZ6115AC6U
MPXAZ6115AC6T1
Packing Options
Rails
Tape and Reel
Rails
Tape and Reel
Marking
MPXAZ6115A
MPXAZ6115A
MPXAZ6115A
MPXAZ6115A
ORDERING INFORMATION—SUPER SMALL OUTLINE PACKAGE
Device Type
Basic Element
Ported Element
Options
Absolute, Element Only
Absolute, Element Only
Absolute, Axial Port
Absolute, Axial Port
Case No.
1317
1317A
1317A
1317A
MPX Series Order No.
MPXHZ6115A6U
MPXHZ6115A6T1
MPXHZ6115AC6U
MPXHZ6115AC6T1
Packing Options
Rails
Tape and Reel
Rails
Tape and Reel
Marking
MPXHZ6115A
MPXHZ6115A
MPXHZ6115A
MPXHZ6115A
MPXAZ6115A
4
For More Information On This Product,
Go to: www.freescale.com
Motorola Sensor Device Data
Freescale Semiconductor, Inc.
SURFACE MOUNTING INFORMATION
MPXAZ6115A MPXHZ6115A SERIES
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.660
16.76
0.100 TYP
2.54
Freescale Semiconductor, Inc...
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
Figure 5. SOP Footprint (Case 482 and 482A)
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.150
3.81
0.387
9.83
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 6. SSOP Footprint (Case 1317 and 1317A)
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
MPXAZ6115A
5
京公网安备 11010802033920号
EEWORLD
