MQ80960MC-25 datasheet, PDF - EEWORLD Datasheet

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MQ80960MC-25: DescriptionRISC Microprocessor, 32-Bit, 25MHz, CMOS, CQFP164, CERAMIC, QFP-164; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，39 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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MQ80960MC-25 Overview

RISC Microprocessor, 32-Bit, 25MHz, CMOS, CQFP164, CERAMIC, QFP-164

MQ80960MC-25 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	QFP
package instruction	GQFF,
Contacts	164
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Address bus width	32
bit size	32
boundary scan	NO
maximum clock frequency	50 MHz
External data bus width	32
Format	FLOATING POINT
Integrated cache	NO
JESD-30 code	S-CQFP-F164
JESD-609 code	e0
length	28.702 mm
low power mode	NO
Number of terminals	164
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	GQFF
Package shape	SQUARE
Package form	FLATPACK, GUARD RING
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.92 mm
speed	25 MHz
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	28.702 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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MQ80960MC-25 Related Products

	MQ80960MC-25	MG80960MC-16	MG80960MC-20	MG80960MC-25	MQ80960MC-20	5962-9094603MXA
Description	RISC Microprocessor, 32-Bit, 25MHz, CMOS, CQFP164, CERAMIC, QFP-164	RISC Microprocessor, 32-Bit, 16MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132	RISC Microprocessor, 32-Bit, 20MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132	RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132	RISC Microprocessor, 32-Bit, 20MHz, CMOS, CQFP164, CERAMIC, QFP-164	RISC Microprocessor, 16-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132
Parts packaging code	QFP	PGA	PGA	PGA	QFP	PGA
package instruction	GQFF,	PGA,	PGA,	PGA,	GQFF,	PGA,
Contacts	164	132	132	132	164	132
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Address bus width	32	32	32	32	32	32
bit size	32	32	32	32	32	16
boundary scan	NO	NO	NO	NO	NO	NO
maximum clock frequency	50 MHz	32 MHz	40 MHz	50 MHz	40 MHz	50 MHz
External data bus width	32	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	NO	NO	NO	NO	NO	NO
JESD-30 code	S-CQFP-F164	S-CPGA-P132	S-CPGA-P132	S-CPGA-P132	S-CQFP-F164	S-CPGA-P132
JESD-609 code	e0	e0	e0	e0	e0	e0
length	28.702 mm	36.802 mm	36.802 mm	36.802 mm	28.702 mm	36.802 mm
low power mode	NO	NO	NO	NO	NO	NO
Number of terminals	164	132	132	132	164	132
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	GQFF	PGA	PGA	PGA	GQFF	PGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, GUARD RING	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, GUARD RING	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.92 mm	4.061 mm	4.061 mm	4.061 mm	2.92 mm	4.061 mm
speed	25 MHz	16 MHz	20 MHz	25 MHz	20 MHz	25 MHz
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb)	TIN LEAD	TIN LEAD
Terminal form	FLAT	PIN/PEG	PIN/PEG	PIN/PEG	FLAT	PIN/PEG
Terminal pitch	0.635 mm	2.54 mm	2.54 mm	2.54 mm	0.635 mm	2.54 mm
Terminal location	QUAD	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	QUAD	PERPENDICULAR
width	28.702 mm	36.802 mm	36.802 mm	36.802 mm	28.702 mm	36.802 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1	1	1	1	1
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	-
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	-
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-

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Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

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