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5962-9461202H4C

Description
Flash Module, 512KX32, 120ns, CHIP66, 1.075 INCH, CERAMIC, HIP-66
Categorystorage    storage   
File Size442KB,22 Pages
ManufacturerMicross
Websitehttps://www.micross.com
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5962-9461202H4C Overview

Flash Module, 512KX32, 120ns, CHIP66, 1.075 INCH, CERAMIC, HIP-66

5962-9461202H4C Parametric

Parameter NameAttribute value
Parts packaging codePGA
package instructionHIP, PGA66,11X11
Contacts66
Reach Compliance Codecompli
ECCN code3A001.A.2.C
Maximum access time120 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
Data pollingYES
JESD-30 codeS-CHIP-P66
JESD-609 codee4
length27.305 mm
memory density16777216 bi
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of departments/size32
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeHIP
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusQualified
Filter levelMIL-STD-883
Maximum seat height4.6 mm
Department size16K
Maximum standby current0.0065 A
Maximum slew rate0.24 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationHEX
switch bitNO
typeNOR TYPE
width27.305 mm
Base Number Matches1
FLASH
Austin Semiconductor, Inc.
512K x 32 FLASH
FLASH MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
SMD 5962-94612
MIL-STD-883
Fast Access Times: 70, 90, 120 and 150ns
Operation with single 5V (±10%)
Theta JC= 1.00°
C
/w
User configurable as 512Kx32, 1Mx16, or 2Mx8
Eight Equal Sectors of 64K Bytes for each 512Kx8
Compatible with JEDEC EEPROM command set
Any Combination of Sectors can be Erased
Supports Full Chip Erase
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built in decoupling caps for low noise operation
Suspend Erase/Resume Function
Individual Byte Read/ Write Control
10,000 Program/Erase Cycles
AS8F512K32
PIN ASSIGNMENT
(Top View)
68 Lead CQFP (Q)
FEATURES
66 Lead PGA (P)
OPTIONS
Timing
70ns
90ns
120ns
150ns
Package
Ceramic Quad Flat pack
Pin Grid Array
MARKINGS
-70
-90
-120
-150
Q
P
No. 702
No. 904
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8F512K32 is a 16 Megabit
CMOS FLASH Memory Module organized as 512Kx32 bits. The
AS8F512K32 achieves high speed access (70 to 150 ns), low power
consumption and high reliability by employing advanced CMOS memory
technology.
An on-chip state machine controls the program and erase func-
tions. The embedded byte-program and sector/chip erase functions are
fully automatic. Data-protection of any sector combination is accom-
plished using a hardware sector-protection feature.
The
Erase/Resume function
allows the sector erase operation to
read data from, or program to a non-erasing sector, then resume the
erase operation.
Device operations are selected by using standard commands into
the command register using standard microprocessor write timings. The
command register acts as an input to an internal state machine that
interprets the commands, controls the erase and programming opera-
tions, outputs the status of the device, and outputs data stored in the
device. On initial power-up operation, the device defaults to the read
mode.
AS8F512K32
Rev. 4.0 6/01
For more products and information
please visit our web site at
www.austinsemiconductor.com
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
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