54VHC244W/883X datasheet, PDF - EEWORLD Datasheet

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54VHC244W/883X: DescriptionIC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,FP,20PIN,CERAMIC; Categorylogic logic; File Size292KB，6 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54VHC244W/883X Overview

IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,FP,20PIN,CERAMIC

54VHC244W/883X Parametric

Parameter Name	Attribute value
package instruction	DFP, FL20,.3
Reach Compliance Code	unknow
Control type	ENABLE LOW
JESD-30 code	R-XDFP-F20
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.008 A
Number of digits	4
Number of functions	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL20,.3
Package shape	RECTANGULAR
Package form	FLATPACK
method of packing	TAPE AND REEL
power supply	2/5.5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

54VHC244W/883X Related Products

	54VHC244W/883X	54VHCT244W/883X	54VHCT244E/883X	54VHCT244J/883X	54VHC244E/883X
Description	IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,FP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,FP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,LLCC,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,LLCC,20PIN,CERAMIC
package instruction	DFP, FL20,.3	DFP, FL20,.3	QCCN, LCC20,.35SQ	DIP, DIP20,.3	QCCN, LCC20,.35SQ
Reach Compliance Code	unknow	unknow	unknown	unknown	unknown
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
JESD-30 code	R-XDFP-F20	R-XDFP-F20	S-XQCC-N20	R-XDIP-T20	S-XQCC-N20
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
Number of digits	4	4	4	4	4
Number of functions	2	2	2	2	2
Number of terminals	20	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DFP	QCCN	DIP	QCCN
Encapsulate equivalent code	FL20,.3	FL20,.3	LCC20,.35SQ	DIP20,.3	LCC20,.35SQ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE
Package form	FLATPACK	FLATPACK	CHIP CARRIER	IN-LINE	CHIP CARRIER
power supply	2/5.5 V	5 V	5 V	5 V	2/5.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
surface mount	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	FLAT	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	QUAD
Base Number Matches	1	1	1	1	1
method of packing	TAPE AND REEL	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL
Load capacitance (CL)	-	50 pF	50 pF	50 pF	-
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	-

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