IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,FP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| package instruction | DFP, FL20,.3 |
| Reach Compliance Code | unknow |
| Control type | ENABLE LOW |
| JESD-30 code | R-XDFP-F20 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL20,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| method of packing | TAPE AND REEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54VHCT244W/883X | 54VHC244W/883X | 54VHCT244E/883X | 54VHCT244J/883X | 54VHC244E/883X | |
|---|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,FP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,FP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,LLCC,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,LLCC,20PIN,CERAMIC |
| package instruction | DFP, FL20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknow | unknow | unknown | unknown | unknown |
| Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-XDFP-F20 | R-XDFP-F20 | S-XQCC-N20 | R-XDIP-T20 | S-XQCC-N20 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DFP | QCCN | DIP | QCCN |
| Encapsulate equivalent code | FL20,.3 | FL20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| power supply | 5 V | 2/5.5 V | 5 V | 5 V | 2/5.5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| surface mount | YES | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Load capacitance (CL) | 50 pF | - | 50 pF | 50 pF | - |
| method of packing | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | - |
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