IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | WDIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Has ADC | YES |
| Address bus width | 11 |
| bit size | 8 |
| maximum clock frequency | 12 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| Number of I/O lines | 21 |
| Number of terminals | 28 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| PWM channel | YES |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Certification status | Not Qualified |
| ROM programmability | OTPROM |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.8928 mm |
| Maximum slew rate | 21 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Base Number Matches | 1 |
| 5962-9157701MXA | 87C752-16/BXA | 5962-9157702MXA | 87C752-16/BXAOT | 87C752/BXA | 87C752/BXAOT | |
|---|---|---|---|---|---|---|
| Description | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | WDIP, | WDIP, | WDIP, | DIP, | WDIP, | DIP, |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Has ADC | YES | YES | YES | YES | YES | YES |
| Address bus width | 11 | 11 | 11 | 11 | 11 | 11 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 |
| maximum clock frequency | 12 MHz | 16 MHz | 16 MHz | 16 MHz | 12 MHz | 12 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
| Number of I/O lines | 21 | 21 | 21 | 21 | 21 | 21 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| PWM channel | YES | YES | YES | YES | YES | YES |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | WDIP | WDIP | DIP | WDIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | IN-LINE, WINDOW | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM programmability | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM |
| Maximum seat height | 5.8928 mm | 5.8928 mm | 5.8928 mm | 5.8928 mm | 5.8928 mm | 5.8928 mm |
| Maximum slew rate | 21 mA | 24 mA | 24 mA | 24 mA | 21 mA | 21 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Maker | NXP | NXP | - | NXP | - | NXP |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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