Microprocessor Circuit, CMOS, PDIP20, PLASTIC, DIP-20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IXYS |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T20 |
| JESD-609 code | e0 |
| length | 26.162 mm |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 3.556 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| IXSE502PI | IXSE503PC | IXSE503PI | IXSE502PC | |
|---|---|---|---|---|
| Description | Microprocessor Circuit, CMOS, PDIP20, PLASTIC, DIP-20 | Microprocessor Circuit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Microprocessor Circuit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Microprocessor Circuit, CMOS, PDIP20, PLASTIC, DIP-20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | IXYS | IXYS | IXYS | IXYS |
| Parts packaging code | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | DIP, | DIP, |
| Contacts | 20 | 24 | 24 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T20 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 26.162 mm | 31.242 mm | 31.242 mm | 26.162 mm |
| Number of terminals | 20 | 24 | 24 | 20 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 | 1 | 1 | - |
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