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IXSE503PC

Description
Microprocessor Circuit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size862KB,17 Pages
ManufacturerIXYS
Download Datasheet Parametric Compare View All

IXSE503PC Overview

Microprocessor Circuit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24

IXSE503PC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIXYS
Parts packaging codeDIP
package instructionDIP,
Contacts24
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T24
JESD-609 codee0
length31.242 mm
Number of terminals24
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height3.556 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
Base Number Matches1

IXSE503PC Related Products

IXSE503PC IXSE502PI IXSE503PI IXSE502PC
Description Microprocessor Circuit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 Microprocessor Circuit, CMOS, PDIP20, PLASTIC, DIP-20 Microprocessor Circuit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 Microprocessor Circuit, CMOS, PDIP20, PLASTIC, DIP-20
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker IXYS IXYS IXYS IXYS
Parts packaging code DIP DIP DIP DIP
package instruction DIP, DIP, DIP, DIP,
Contacts 24 20 24 20
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-PDIP-T24 R-PDIP-T20 R-PDIP-T24 R-PDIP-T20
JESD-609 code e0 e0 e0 e0
length 31.242 mm 26.162 mm 31.242 mm 26.162 mm
Number of terminals 24 20 24 20
Maximum operating temperature 70 °C 85 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.556 mm 3.556 mm 3.556 mm 3.556 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Base Number Matches 1 1 1 -
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