F-214
DPAM–23–07.0–S–8–2–A
®
DPAF–23–03.0–S–8–2–A
(2,16 mm) .085"
DPAM, DPAF SERIES
HIGH DENSITY DIFFERENTIAL PAIR ARRAY
DPAM Mates with:
DPAF
DPAF Mates with:
DPAM
DPAM
PAIRS
PER ROW
07.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
OPTION
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?DPAM or
www.samtec.com?DPAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au over 50µ" (1,27 µm) Ni
Current Rating (2x3):
2.9 A per pin
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
10.4mΩ
Working Voltage:
300 VAC
Mated Cycles:
100 Cycles
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
– 04, –06
– 08, –15, –23
–8
–S
=30µ" (0,76 µm)
Gold on contact area,
Tin on solder tail
=Eight
Pair
Rows
–2
= Lead-Free
Tin Alloy
96.5% Sn/
3% Ag/.5% Cu
Solder Crimp
–K
=(20,00 mm) 0.80"
DIA Polyimide
film Pick &
Place Pad
–3
=Three
Pair
Rows
(2,54)
.100
–TR
=Tape & Reel
G1
Perimeter
Grounds (TYP)
–GP
=Guide Post
(–23 only)
A
(2,54)
.100
NO OF
ROWS
–8
–3
A
(24,59) .968
(11,89) .468
02 01 G2 03 04
Signal Pairs (TYP)
No. of positions x (2,16) .085 + (4,34) .171
(6,66)
.262
(2,16) .085
(1,27)
.050
(1,08) .0425
(1,27)
.050
DIA
(0,13)
.005
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
No. of positions x (2,16) .085 + (2,95) .116
DPAM/DPAF
Rated @ 3dB Insertion Loss*
10 mm Stack Height
Single-Ended Signaling
8 GHz / 16 Gbps
Differential Pair Signaling
7 GHz / 14 Gbps
*Performance data includes effects of a non-optimized PCB.
Complete test data available at www.samtec.com?DPAM,
www.samtec.com?DPAF or contact sig@samtec.com
cols
roto rted
P
o
Supp
note
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG n protocols
o
for questions
el
Fibre Chann
Rapid I/O
®
PCI Express
SATA
™
InfiniBand
XAUI
et I/O)
MGT (Rock
s at
DPAF
PAIRS
PER ROW
03.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
OPTION
– 04, – 06, – 08,
–15, –23
–S
=30µ" (0,76 µm)
Gold on contact area,
Tin on solder tail
–8
=Eight
Pair Rows
–2
= Lead-Free Tin Alloy
96.5% Sn/ 3%Ag/
.5% Cu
Solder Crimp
–K
=(20,00 mm)
0.80" DIA
Polyimide
film
Pick &
Place Pad
–3
=Three
Pair Rows
Signal
Pairs
(TYP)
04
No. of positions x (2,16) .085 + (4,34) .171
G1
NO OF
ROWS
–8
–3
A
(23,32)
.918
(10,62)
.418
SIZE
–04 x –3
–06 x –3
–04 x –8
–06 x –8
–08 x –8
–15 x –8
–23 x –8
–08 x –3
–15 x –3
–23 x –3
USABLE PAIRS
PER ARRAY*
6 Pairs
12 Pairs
16 Pairs
32 Pairs
48 Pairs
–TR
=Tape
& Reel
ALSO AVAILABLE
(MOQ Required)
• Tin-Lead Solder Charge
• Other platings
Contact Samtec.
Note:
Patented
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
A
(1,52)
.060
(1,27) .050
G2
02
(2,54)
01
.100
Perimeter Grounds (TYP)
03
(6,45)
.254
(2,16) .085
Solder crimped on tail
(1,08) .0425
No. of positions x (2,16) .085 + (2,95) .116
(1,27)
.050
DIA
(0,13)
.005
DPAF
DPAM MATED
LEAD HEIGHT*
STYLE
–03.0
10 mm
–07.0
*Processing
conditions will
affect mated height.
(1,27)
.050
104 Pairs
168 Pairs
18 Pairs
39 Pairs
63 Pairs
*Assumes first and last pair in
each row are grounded
WWW.SAMTEC.COM
Embedded System
京公网安备 11010802033920号
EEWORLD
