EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202GS-02-5010-J

Description
Fixed Resistor, Thin Film, 0.25W, 501ohm, 100V, 5% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202GS-02-5010-J Overview

Fixed Resistor, Thin Film, 0.25W, 501ohm, 100V, 5% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202GS-02-5010-J Parametric

Parameter NameAttribute value
Objectid1579412926
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance501 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeONE SURFACE
Tolerance5%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
Finding a job is a difficult and long process
I've actually started looking for a job. I've finally started looking for a job. I've been in school for five years. Time has gone by fast and slow at the same time. It's so fast that I still remember...
Eili Talking
Weekly plan + multi-function debugging and testing assistant
Weekly plan + multi-function debugging and testing assistant overall step arrangement...
蓝雨夜 Renesas Electronics MCUs
DSP+GC5322 realizes digital pre-distortion system
Digital pre-distortion technology has been initially developed in software implementation. At present, general pre-distortion technology adopts software architecture, uses digital signal processor to ...
fish001 Microcontroller MCU
What is the difference between a vector signal analyzer and a spectrum analyzer?
Traditional spectrum analyzers use a swept-frequency tuning architecture and have a higher frequency range and wider dynamic range than vector signal analyzers, and generally have better overall RF ch...
cscl Test/Measurement
“This is a pitfall” People and procedures in the project
[align=left]Speaking of the topic of "this is a pit", it reminds me of the experience of people and programs in a project. [/align][align=left]At the beginning, we took over a project of a private ent...
jinglixixi MCU
The little car is moving forward quickly
Yesterday, I got up at 6 o'clock in the morning with great enthusiasm to watch the Freescale National College Student Intelligent Car Competition held in the new gymnasium of the Minhang campus of Sha...
liongff MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1438  2208  277  2308  2007  29  45  6  47  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号