SPST, 4 Func, CMOS, PDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Vishay |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| normal position | NC |
| Number of functions | 4 |
| Number of terminals | 16 |
| Maximum on-state resistance (Ron) | 125 Ω |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| output | SEPARATE OUTPUT |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum connection time | 200 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DG309CJ-4 | DG308ACY | DG309CY | |
|---|---|---|---|
| Description | SPST, 4 Func, CMOS, PDIP16 | Multiplexers/Switches, | Multiplexers/Switches |
| Maker | Vishay | Vishay | Vishay |
| package instruction | DIP, DIP16,.3 | SOP, SOP16,.25 | , |
| Reach Compliance Code | unknown | unknown | unknown |
| Is it Rohs certified? | incompatible | incompatible | - |
| Analog Integrated Circuits - Other Types | SPST | SPST | - |
| JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | - |
| JESD-609 code | e0 | e0 | - |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | - |
| normal position | NC | NO | - |
| Number of functions | 4 | 4 | - |
| Number of terminals | 16 | 16 | - |
| Maximum on-state resistance (Ron) | 125 Ω | 125 Ω | - |
| Maximum operating temperature | 70 °C | 70 °C | - |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | DIP | SOP | - |
| Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | SMALL OUTLINE | - |
| power supply | +-15 V | +-15 V | - |
| Nominal supply voltage (Vsup) | 15 V | 15 V | - |
| surface mount | NO | YES | - |
| Maximum connection time | 200 ns | 200 ns | - |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - |
| technology | CMOS | CMOS | - |
| Temperature level | COMMERCIAL | COMMERCIAL | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | GULL WING | - |
| Terminal pitch | 2.54 mm | 1.27 mm | - |
| Terminal location | DUAL | DUAL | - |