EEWORLDEEWORLDEEWORLD

Part Number

Search

TXB2P-019-028ND

Description
thermal link press ON nickel TO-
CategoryThermal management products   
File Size137KB,2 Pages
ManufacturerCTS [CTS Corporation]
Environmental Compliance  
Download Datasheet Parametric View All

TXB2P-019-028ND Online Shopping

Suppliers Part Number Price MOQ In stock  
TXB2P-019-028ND - - View Buy Now

TXB2P-019-028ND Overview

thermal link press ON nickel TO-

TXB2P-019-028ND Parametric

Parameter NameAttribute value
Datasheets
Heatsinks, Thermal Links
Product Photos
TXB2P-019-028ND
Catalog Drawings
TX(B2)P Series
Standard Package100
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeTop Mou
Package CooledTO-18
Attachment MethodPress Fit, Bolt O
ShapeCylindrical
Length0.280" (7.11mm)
Width0.220" (5.59mm)
Diamete0.220" (5.59mm) OD
Height Off Base (Height of Fin)-
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural108°C/W
MaterialBrass
Material FinishDull Nickel
Other Names294-1141
CTS
®
iZIF
HEAT FRAME
GENERAL DESCRIPTION
The iZIF
is a custom aluminum heat frame that integrates
the PCB retainer for improved structural integrity and thermal
efficiency (.8°C-in./W). The iZIF
is a highly reliable patent-
pending design for rugged military and aerospace circuit card
applications. It features a quarter-turn lock, uniform clamping
pressure, and can be sized to fit small daughter cards up to
9U VME. A bottom plate may also be added for additional
cooling and structural integrity. The iZIF
features a 1/8”
stainless steel socket head cap rod with beryllium copper
spring. A variety of finishes are available such as chemical
film, black anodize, and electroless nickel.
THERMAL LINKS
GENERAL DESCRIPTION
CTS’s thermal links provide superior retention because
of the 6 to 8-segment fingers versus the 2 or 3-segment
fingers available from other manufacturers. These thermal
links are offered for TO-5s, TO-8s and TO-18s with or
without BeO washer and other appropriate hardware.
They provide an effective retainer and efficient thermal
path between semiconductor and heat sinks or chassis.
There is excellent transistor retention under high
vibration and shock loads. The thermal links can be
inserted and removed multiple times without loss of
retention or damage to the finish over the entire JEDEC
case diameter range. They can be installed with a rivet or
eyelet, soldered to a PC pad or heat sink, mounted with a
single screw or with a threaded stud and hex nut.
FAN TOP SERIES
A
B
Fan Tops
“A”
Dim.
.25
.25
.25
.25
.36
.33
.12
.12
“B” Semiconductor
Dim.
Case Type
*Ø °C/W
.50
.50
.75
.75
1.25
1.25
1.25
1.25
TO-18
TO-18
TO-5
TO-5
TO-5
TO-8
TO-5
TO-8
150.0
150.0
81.1
81.1
57.7
41.0
56.6
56.6
Unplated
Part Number
Black Cadmium
Black Chem.
Material
BeCu
Brass
BeCu
Brass
Brass Fan
BeCu Retainer
Brass Fan
BeCu Retainer
Brass
Brass
TXBF-019-025U TXBF-019-025B
N.A.
TXCF-019-025U
N.A.
TXCF-019-025CB
TXBF-032-025U TXBF-032-025B
N.A.
TXCF-032-025U
N.A.
TXCF-032-025CB
TXBF2-032-036U TXBF2-032-036B
N.A.
TXBF2-050-033U TXBF2-050-033B
TXCF-125-1U
TXCF-125-2U
TXCF-125-1CB
TXCF-125-2B
N.A.
N.A.
N.A.
*Natural convection, case-ambient mounted on G10 board
18

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2276  1338  1352  2316  2414  46  27  28  47  49 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号